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• Advanced Process Technology
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• Key Parameters Optimized for Class-D Audio Amplifier
Applications
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• Low RDSON for Improved Efficiency
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| • Low QG and Qsw for Better THD and Improved Efficiency |
| • Low Qrr for Better THD and Lower EMI |
| • 175°C Operating Junction Temperature for Ruggedness |
| • Repetitive Avalanche Capability for Robustness and
Reliability
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| • Lead-Free
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|
| CATALOG |
| IRLIB9343PbF COUNTRY OF ORIGIN |
| IRLIB9343PBF LIFECYCLE |
IRLIB9343PbF PARAMETRIC INFO
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IRLIB9343PbF PACKAGE INFO
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IRLIB9343PbF MANUFACTURING INFO
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IRLIB9343PbF PACKAGING INFO
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IRLIB9343PbF ECAD MODELS
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| COUNTRY OF ORIGIN |
| United States of America |
| Mexico |
| China |
|
| LIFECYCLE |
Obsolete
Oct 31,2020 |
|
PARAMETRIC INFO
|
| Channel Type |
P |
| Channel Mode |
Enhancement |
| Configuration |
Single |
| Maximum Drain Source Voltage (V) |
55 |
| Material |
Si |
| Maximum Continuous Drain Current (A) |
14 |
| Maximum Absolute Continuous Drain Current (A) |
14 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
105@10V |
| Typical Gate Charge @ Vgs (nC) |
31@10V |
| Typical Gate Charge @ 10V (nC) |
31 |
| Maximum Power Dissipation (mW) |
33000 |
| Process Technology |
HEXFET |
| Category |
Power MOSFET |
| Typical Input Capacitance @ Vds (pF) |
660@50V |
| Typical Turn-On Delay Time (ns) |
9.5 |
| Typical Turn-Off Delay Time (ns) |
21 |
| Typical Fall Time (ns) |
9.5 |
| Typical Rise Time (ns) |
24 |
| Maximum Gate Threshold Voltage (V) |
1 |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
175 |
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|
PACKAGE INFO
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| Supplier Package |
TO-220FP |
| Basic Package Type |
Through Hole |
| Pin Count |
3 |
| Lead Shape |
Through Hole |
| PCB |
3 |
| Tab |
Tab |
| Package Length (mm) |
10.6(Max) |
| Package Width (mm) |
4.8(Max) |
| Package Height (mm) |
16(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Through Hole |
| Package Description |
Transistor Outline Package Fullpak |
| Package Family Name |
TO |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed|Matte Sn |
| Under Plating Material |
N/A|Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
3 Years |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
2000 |
|
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ECAD MODELS
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