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• Floating channel designed for bootstrap operation to +600 V
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• Tolerant to negative transient voltage, dV/dt immune
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• Gate drive supply range from 10 V to 20 V
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• Undervoltage lockout for both channels
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• 3.3 V, 5 V, and 15 V input logic input compatible |
• Cross-conduction prevention logic |
• Matched propagation delay for both channels |
• Lower di/dt gate driver for better noise immunity |
• Internal 100 ns deadtime |
• Output in phase with input |
• RoHS compliant |
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CATALOG |
IRS2304STRPbF COUNTRY OF ORIGIN |
IRS2304STRPbF PARAMETRIC INFO
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IRS2304STRPbF PACKAGE INFO
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IRS2304STRPbF MANUFACTURING INFO
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IRS2304STRPbF PACKAGING INFO
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COUNTRY OF ORIGIN |
Malaysia |
Thailand |
China |
Indonesia |
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PARAMETRIC INFO
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Driver Type |
High and Low Side |
Number of Drivers |
2 |
Bridge Type |
Half Bridge |
Input Logic Compatibility |
CMOS|LSTTL|3.3V(Min)|5V|15V |
Maximum Operating Supply Voltage (V) |
20 |
type |
IGBT|MOSFET |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Maximum Turn-Off Delay Time (ns) |
50 |
Maximum Turn-On Delay Time (ns) |
50 |
High and Low Sides Dependency |
Independent |
Number of Outputs |
2 |
Maximum Power Dissipation (mW) |
625 |
Minimum Operating Supply Voltage (V) |
10 |
Absolute Propagation Delay Time (ns) |
210 |
Maximum Propagation Delay Time (ns) |
210 |
Maximum Rise Time (ns) |
120 |
Maximum Fall Time (ns) |
60 |
Typical Input High Threshold Voltage (V) |
2.3(Min) |
Typical Input Low Threshold Voltage (V) |
0.7(Max) |
Special Features |
Under Voltage Lockout |
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PACKAGE INFO
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Supplier packaging |
SOIC N |
Basic package type |
Lead-Frame SMT |
Number of pins |
8 |
Pin shape |
Gull-wing |
PCB |
8 |
ears |
N/R |
Pin spacing (mm) |
1.27 |
Package length (mm) |
5(Max) |
Package width (mm) |
4(Max) |
Package height (mm) |
1.5(Max) |
Package diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Mounting surface height (mm) |
1.75(Max) |
Install |
Surface Mount |
Packaging materials |
Plastic |
package instruction |
Small Outline IC |
Package series name |
SO |
JEDEC |
MS-012AA |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
10 to 30 |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
300 |
Wave soldering time (seconds) |
10 |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Plating materials |
not applicable |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
3 Years |
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PACKAGING INFO
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Packaging Suffix |
TR |
Package |
Tape and reel packaging |
Packing quantity |
2500 |
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