IRS2304STRPbF Infineon Technologies IC DVR HALF BRIDGE HV HS 8-SOIC

label:
2024/04/16 274

• Floating channel designed for bootstrap operation to +600 V
• Tolerant to negative transient voltage, dV/dt immune
• Gate drive supply range from 10 V to 20 V
• Undervoltage lockout for both channels
• 3.3 V, 5 V, and 15 V input logic input compatible
• Cross-conduction prevention logic
• Matched propagation delay for both channels
• Lower di/dt gate driver for better noise immunity
• Internal 100 ns deadtime
• Output in phase with input
•  RoHS compliant



CATALOG
IRS2304STRPbF COUNTRY OF ORIGIN
IRS2304STRPbF PARAMETRIC INFO
IRS2304STRPbF PACKAGE INFO
IRS2304STRPbF MANUFACTURING INFO
IRS2304STRPbF PACKAGING INFO



COUNTRY OF ORIGIN
Malaysia
Thailand
China
Indonesia



PARAMETRIC INFO
Driver Type High and Low Side
Number of Drivers 2
Bridge Type Half Bridge
Input Logic Compatibility CMOS|LSTTL|3.3V(Min)|5V|15V
Maximum Operating Supply Voltage (V) 20
type IGBT|MOSFET
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Maximum Turn-Off Delay Time (ns) 50
Maximum Turn-On Delay Time (ns) 50
High and Low Sides Dependency Independent
Number of Outputs 2
Maximum Power Dissipation (mW) 625
Minimum Operating Supply Voltage (V) 10
Absolute Propagation Delay Time (ns) 210
Maximum Propagation Delay Time (ns) 210
Maximum Rise Time (ns) 120
Maximum Fall Time (ns) 60
Typical Input High Threshold Voltage (V) 2.3(Min)
Typical Input Low Threshold Voltage (V) 0.7(Max)
Special Features Under Voltage Lockout


PACKAGE INFO
Supplier packaging SOIC N
Basic package type Lead-Frame SMT
Number of pins 8
Pin shape Gull-wing
PCB 8
ears N/R
Pin spacing (mm) 1.27
Package length (mm) 5(Max)
Package width (mm) 4(Max)
Package height (mm) 1.5(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Mounting surface height (mm) 1.75(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Small Outline IC
Package series name SO
JEDEC MS-012AA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 2
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 10 to 30
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) 300
Wave soldering time (seconds) 10
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy
Shelf Life Period 3 Years


PACKAGING INFO
Packaging Suffix TR
Package Tape and reel packaging
Packing quantity 2500
 
Продукт RFQ