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• Floating channel designed for bootstrap operation to +600 V
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• Tolerant to negative transient voltage, dV/dt immune
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• Gate drive supply range from 10 V to 20 V
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| • Undervoltage lockout for both channels
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| • 3.3 V, 5 V, and 15 V input logic input compatible |
| • Cross-conduction prevention logic |
| • Matched propagation delay for both channels |
| • Lower di/dt gate driver for better noise immunity |
| • Internal 100 ns deadtime |
| • Output in phase with input |
| • RoHS compliant |
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| CATALOG |
| IRS2304STRPbF COUNTRY OF ORIGIN |
IRS2304STRPbF PARAMETRIC INFO
|
IRS2304STRPbF PACKAGE INFO
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IRS2304STRPbF MANUFACTURING INFO
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IRS2304STRPbF PACKAGING INFO
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|
| COUNTRY OF ORIGIN |
| Malaysia |
| Thailand |
| China |
| Indonesia |
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PARAMETRIC INFO
|
| Driver Type |
High and Low Side |
| Number of Drivers |
2 |
| Bridge Type |
Half Bridge |
| Input Logic Compatibility |
CMOS|LSTTL|3.3V(Min)|5V|15V |
| Maximum Operating Supply Voltage (V) |
20 |
| type |
IGBT|MOSFET |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Turn-Off Delay Time (ns) |
50 |
| Maximum Turn-On Delay Time (ns) |
50 |
| High and Low Sides Dependency |
Independent |
| Number of Outputs |
2 |
| Maximum Power Dissipation (mW) |
625 |
| Minimum Operating Supply Voltage (V) |
10 |
| Absolute Propagation Delay Time (ns) |
210 |
| Maximum Propagation Delay Time (ns) |
210 |
| Maximum Rise Time (ns) |
120 |
| Maximum Fall Time (ns) |
60 |
| Typical Input High Threshold Voltage (V) |
2.3(Min) |
| Typical Input Low Threshold Voltage (V) |
0.7(Max) |
| Special Features |
Under Voltage Lockout |
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|
PACKAGE INFO
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| Supplier packaging |
SOIC N |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
8 |
| Pin shape |
Gull-wing |
| PCB |
8 |
| ears |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
5(Max) |
| Package width (mm) |
4(Max) |
| Package height (mm) |
1.5(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Mounting surface height (mm) |
1.75(Max) |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Small Outline IC |
| Package series name |
SO |
| JEDEC |
MS-012AA |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
10 to 30 |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
300 |
| Wave soldering time (seconds) |
10 |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
3 Years |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Package |
Tape and reel packaging |
| Packing quantity |
2500 |
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