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| CATALOG |
IS61C5128AS-25TLI COUNTRY OF ORIGIN
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IS61C5128AS-25TLI PARAMETRIC INFO
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IS61C5128AS-25TLI PACKAGE INFO
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IS61C5128AS-25TLI MANUFACTURING INFO
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COUNTRY OF ORIGIN
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Switzerland
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Density (bit) |
4M |
| Timing Type |
Asynchronous |
| Data Rate Architecture |
SDR |
| Maximum Access Time (ns) |
25 |
| Typical Operating Supply Voltage (V) |
5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Density in Bits (bit) |
4194304 |
| Number of Bits per Word (bit) |
8 |
| Number of Ports |
1 |
| Number of Words |
512K |
| Maximum Operating Current (mA) |
15 |
| Number of I/O Lines (bit) |
8 |
| Address Bus Width (bit) |
19 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
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PACKAGE INFO
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| Supplier Package |
TSOP-II |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
Gull-wing |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
21.08(Max) |
| Package Width (mm) |
10.29(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
21.08(Max) |
| Package Overall Width (mm) |
11.96(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package (Type II) |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi |
| Number of Wave Cycles |
N/R |
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