 |
|
| • -7V to +12V common-mode output voltage range
(VCC ≤ 3.6V only)
|
| • Current limiting and thermal shutdown for driver overload
protection (VCC ≤ 3.6V only) |
| • Tri-statable Tx outputs |
| • 5V tolerant logic inputs when VCC ≤5V |
| • Pb-free (RoHS compliant) |
|
| CATALOG |
| ISL3295EIHZ-T COUNTRY OF ORIGIN |
| ISL3295EIHZ-T PARAMETRIC INFO |
| ISL3295EIHZ-T PACKAGE INFO |
| ISL3295EIHZ-T MANUFACTURING INFO |
| ISL3295EIHZ-T PACKAGING INFO |
| ISL3295EIHZ-T APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| United States of America |
|
| PARAMETRIC INFO |
| Function |
Line Transmitter |
| Number of Transmitters |
1 |
| Data Transmission Topology |
Multidrop|Multipoint |
| Transmitter Signal Type |
Differential |
| Transmitter Communication Type |
RS-422|RS-485 |
| Charge Pump |
No |
| Number of External Capacitors |
4 |
| Input Logic Level |
CMOS |
| Output Logic Level |
CMOS |
| External Capacitor Capacitance (uF) |
0.1 |
| Power Down Mode |
Shutdown |
| Typical Shutdown Current (uA) |
0.01 |
| Interface Standards |
RS-422|RS-485 |
| Number of Transmitter Enables |
1 |
| Number of Drivers per Line |
1@RS-422|256@RS-485 |
| Data Rate |
20Mbps(Min) |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Single |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Minimum Single Supply Voltage (V) |
3 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
0.15 |
| Isolation |
No |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.6 |
| Package Height (mm) |
1.15 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AB |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000|3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
| |
| APPLICATIONS |
| • Clock distribution |
| • High node count systems |
| • Space constrained systems |
| • Security camera networks |
| • Building environmental control/lighting systems |
| • Industrial/process control networks |
|
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