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• Serial Data Bus
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• Dual Outputs:- Configurable 3-, 2- or 1-phase for the 1st Output Using Two Integrated Gate Drivers- Configurable 2- or 1-phase for the 2nd Output Using One Integrated Gate Driver
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• R3 Modulator- Excellent Transient Response- High Light Load Efficiency
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• 0.5% System Accuracy Over-Temperature
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• Supports Multiple Current Sensing Methods- Lossless Inductor DCR Current Sensing- Precision Resistor Current Sensing
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• Differential Remote Voltage Sensing
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• Programmable VBOOT Voltage at Start-up
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• Resistor Programmable IMAX, Switching Frequency for Both Outputs
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• Adaptive Body Diode Conduction Time Reduction
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| CATALOG |
ISL95836IRTZ-T COUNTRY OF ORIGIN
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ISL95836IRTZ-T PARAMETRIC INFO
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ISL95836IRTZ-T PACKAGE INFO
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ISL95836IRTZ-T MANUFACTURING INFO
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ISL95836IRTZ-T PACKAGING INFO
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ISL95836IRTZ-T APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Output Voltage (V) |
0.25 to 1.52 |
| Output Current (mA) |
90000(Max) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
100 |
| On/Off Pin |
No |
| Adjustable Output |
Yes |
| Synchronous Pin |
No |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Type |
Current Mode PWM Controller |
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PACKAGE INFO
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| Supplier Package |
TQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
40 |
| Lead Shape |
No Lead |
| PCB |
40 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.4 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.7 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
5 |
| Package Overall Height (mm) |
0.75 |
| Seated Plane Height (mm) |
0.75 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220WHEE-1 |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250|1000|6000 |
| Reel Diameter (in) |
7|13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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| APPLICATIONS |
| • IMVP-7/VR12 Compliant Computers |
| |
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