ГлавнаяБлогISO1050DUBR Texas Instruments 1/1 Transceiver Half CANbus 8-SOP

ISO1050DUBR Texas Instruments 1/1 Transceiver Half CANbus 8-SOP

label:
2024/02/21 218



• Meets the requirements of ISO11898-2
• 5000-VRMS isolation (ISO1050DW)
• 2500-VRMS isolation (ISO1050DUB)
• Fail-safe outputs
• Low loop delay: 150 ns (typical), 210 ns(maximum)
• 50-kV/μs typical transient immunity
• Bus-fault protection of –27 V to 40 V
• Driver (TXD) dominant time-out function
• I/O voltage range supports 3.3 V and 5 Vmicroprocessors
• Safety-related certifications
   – VDE approval per DIN EN IEC 60747-17 (VDE0884-17)
   – UL 1577 approved
   – CSA approved for IEC 61010-1, IEC 60601-1
   – TUV Reinforced Insulation Approval forEN/UL/CSA 62368-1 (ISO1050DW-Only)
   – CQC reinforced insulation per GB4943.1(ISO1050DW-only)
   – Typical 25-year life at rated working voltage(see application report SLLA197 and LifeExpectancy vs Working Voltage)


CATALOG
ISO1050DUBR COUNTRY OF ORIGIN
ISO1050DUBR PARAMETRIC INFO
ISO1050DUBR PACKAGE INFO
ISO1050DUBR MANUFACTURING INFO
ISO1050DUBR PACKAGING INFO
ISO1050DUBR ECAD MODELS
ISO1050DUBR FUNCTIONAL BLOCK DIAGRAM 
ISO1050DUBR APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia
Thailand
Taiwan (Province of China)


PARAMETRIC INFO
Category Transceiver
Maximum Data Rate 1Mbps
Standard Supported ISO 11898-2
Number of Transceivers 1
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 105
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Typical Operating Supply Voltage (V) 3.3|5
Minimum Operating Supply Voltage (V) 3|4.75
Maximum Operating Supply Voltage (V) 5.25|5.5
Maximum Supply Current (mA) 3.6|73
Manufacture Type Isolated CAN Transceiver


PACKAGE INFO
Supplier Package SOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 9.55(Max)
Package Width (mm) 6.67(Max)
Package Height (mm) 3.35(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 9.55(Max)
Package Overall Width (mm) 10.7(Max)
Package Overall Height (mm) 4.85(Max)
Seated Plane Height (mm) 4.85(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Plastic Small Outline Package
Package Family Name SO
Jedec MS-001BA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3|4
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 350
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Industrial automation, control, sensors, and drivesystems
• Building and climate control (HVAC) automation
• Security systems
• Transportation
• Medical
• Telecom
• CAN bus standards such as CANopen, DeviceNet,NMEA2000, ARINC825, ISO11783, CAN Kingdom,CANaerospace


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