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• Meets the requirements of ISO11898-2
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• 5000-VRMS isolation (ISO1050DW)
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• 2500-VRMS isolation (ISO1050DUB)
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| • Fail-safe outputs
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| • Low loop delay: 150 ns (typical), 210 ns(maximum) |
| • 50-kV/μs typical transient immunity |
| • Bus-fault protection of –27 V to 40 V |
| • Driver (TXD) dominant time-out function |
| • I/O voltage range supports 3.3 V and 5 V microprocessors |
• Safety-related certifications– VDE approval per DIN EN IEC 60747-17 (VDE0884-17)– UL 1577 approved– CSA approved for IEC 61010-1, IEC 60601-1
– TUV Reinforced Insulation Approval forEN/UL/CSA 62368-1 (ISO1050DW-Only)– CQC reinforced insulation per GB4943.1(ISO1050DW-only)– Typical 25-year life at rated working voltage(see application report SLLA197 and Life Expectancy vs Working Voltage) |
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| CATALOG |
| ISO1050DWR COUNTRY OF ORIGIN |
ISO1050DWR PARAMETRIC INFO
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ISO1050DWR PACKAGE INFO
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ISO1050DWR MANUFACTURING INFO
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ISO1050DWR PACKAGING INFO
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ISO1050DWR EACD MODELS
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| ISO1050DWR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
| Thailand |
| Malaysia |
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PARAMETRIC INFO
|
| Category |
Transceiver |
| Maximum Data Rate |
1Mbps |
| Standard Supported |
ISO 11898-2 |
| Number of Transceivers |
1 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
105 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Supply Voltage (V) |
3|4.75 |
| Maximum Operating Supply Voltage (V) |
5.25|5.5 |
| Maximum Supply Current (mA) |
3.6|73 |
| Manufacture Type |
Isolated CAN Transceiver |
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|
PACKAGE INFO
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| Supplier packaging |
SOIC |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
16 |
| Pin shape |
Gull-wing |
| PCB |
16 |
| ears |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
10.5(Max) |
| Package width (mm) |
7.6(Max) |
| Package height (mm) |
2.35(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.5(Max) |
| Package Overall Width (mm) |
10.63(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Mounting surface height (mm) |
2.65(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline IC |
| Package series name |
SO |
| JEDEC |
MS-013AA |
| Package outline |
Link to datasheet |
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|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Industrial automation, control, sensors, and drive systems |
| • Building and climate control (HVAC) automation |
| • Security systems |
| • Transportation |
| • Medical |
| • Telecom |
| • CAN bus standards such as CANopen, DeviceNet,NMEA2000, ARINC825, ISO11783, CAN Kingdom,CANaerospace |
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