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• 100% Tested for High-Voltage Breakdown
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• Rated 1500 Vrms
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• High IMR: 140 dB at 60 Hz
|
• Maximum Nonlinearity: 0.010%
|
• Bipolar Operation: VO = ±10 V
|
• Packages: PDIP-16 and SOIC-28
|
• Ease of Use: Fixed Unity Gain Configuration
|
• Supply Range: ±4.5-V to ±18-V
|
|
| CATALOG |
ISO124U/1K COUNTRY OF ORIGIN
|
ISO124U/1K PARAMETRIC INFO
|
ISO124U/1K PACKAGE INFO
|
ISO124U/1K MANUFACTURING INFO
|
ISO124U/1K PACKAGING INFO
|
ISO124U/1K ECAD MODELS
|
ISO124U/1K APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
|
Thailand
|
Philippines
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Type |
Isolation Amplifier |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Maximum Input Offset Voltage (mV) |
50@±15V |
| Maximum Quiescent Current (mA) |
7@±15V |
| Typical Output Current (mA) |
15@±15V |
| Minimum DC Continuous Isolation Voltage (V) |
2400 |
| Maximum Input Resistance (MOhm) |
0.2(Typ)@5V |
| Maximum Voltage Gain Range (dB) |
<35 |
| Maximum Voltage Gain (dB) |
0(Typ) |
| Minimum Operating Temperature (°C) |
-25 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Minimum Dual Supply Voltage (V) |
±4.5 |
| Typical Dual Supply Voltage (V) |
±5|±9|±12|±15 |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Operating Supply Voltage (V) |
±18 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
18.1(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Plastic Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MS-013AE |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
1K |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
24.4 |
| Tape Pitch (mm) |
2 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Industrial Process Control:
– Transducer Isolator, Isolator for
Thermocouples, RTDs, Pressure Bridges, and
Flow Meters, 4-mA to 20-mA Loop Isolation
|
| • Ground Loop Elimination |
• INDUSTRIAL HIGH-VOLTAGE I/O
|
• 3-WIRE-SENSOR CURRENT OR VOLTAGE OUTPUT
|
| • ±10V 2- AND 4-WIRE VOLTAGE OUTPUT U.S. Patent Nos. 7,427,898, 7,425,848, and 7,449,873 |
| • Motor and SCR Control |
• Power Monitoring
|
• PC-Based Data Acquisition
|
• Test Equipment
|
| |
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