ISO3086DWR Texas Instruments DG ISO 2.5KV RS422/RS485 16SOIC

label:
2023/11/10 282

 
• Meets or exceeds TIA/EIA RS-485 requirements
• Signaling rates up to 20 Mbps
• 1/8 unit load – up to 256 nodes on a bus
• Thermal shutdown protection
• Low bus capacitance – 16 pF (typical)  
• 50 kV/μs typical transient immunity
• Fail-safe receiver for bus open, short, idle
• 3.3-V inputs are 5-V tolerant
• Bus-pin ESD protection
   – 12-kV HBM between bus pins and GND2
   – 6-kV HBM between bus pins and GND1
• Safety-related certifications:
   – 4000-VPK basic insulation, 560 VPK VIORM per DIN EN IEC 60747-17 (VDE 0884-17)
   – 2500 VRMS isolation per UL 1577
   – 4000 VPK isolation per CSA 62368-1


CATALOG
ISO3086DWR COUNTRY OF ORIGIN
ISO3086DWR PARAMETRIC INFO
ISO3086DWR PACKAGE INFO
ISO3086DWR MANUFACTURING INFO
ISO3086DWR PACKAGING INFO
ISO3086DWR ECAD MODELS
ISO3086DWR FUNCTIONAL BLOCK DIAGRAMS
ISO3086DWR APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Function Line Transceiver
Number of Transceivers 1
Number of Transmitters 1
Number of Receivers 1
Data Transmission Topology Multidrop|Multipoint
Transmitter Signal Type Differential
Receiver Signal Type Differential
Transmitter Communication Type RS-485
Charge Pump No
Receiver Communication Type RS-485
Channel Operating Mode Full Duplex
Fail Safe Open/Short
Interface Standards EIA/TIA-422|EIA/TIA-485|RS-485
Number of Transmitter Enables 1
Number of Receiver Enables 1
Number of Drivers per Line 1
Number of Receivers per Line 1
Data Rate 20Mbps
Driving Mode 3-State
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Dual
Typical Dual Supply Voltage (V) 3.3|5
Maximum Dual Supply Voltage (V) 5.5
Maximum Supply Current (mA) 15
Isolation Yes
 
PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 10.5(Max)
Package Width (mm) 7.6(Max)
Package Height (mm) 2.35(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10.5(Max)
Package Overall Width (mm) 10.63(Max)
Package Overall Height (mm) 2.65(Max)
Seated Plane Height (mm) 2.65(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-013AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 12
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAMS


APPLICATIONS
• Security systems
• Chemical production
• Factory automation
• Motor and motion control
• HVAC and building automation networks
• Networked security stations


Продукт RFQ