|
|
| • Meets or exceeds TIA/EIA RS-485 requirements |
| • Signaling rates up to 20 Mbps |
| • 1/8 unit load – up to 256 nodes on a bus |
| • Thermal shutdown protection |
| • Low bus capacitance – 16 pF (typical)
|
| • 50 kV/μs typical transient immunity |
| • Fail-safe receiver for bus open, short, idle |
| • 3.3-V inputs are 5-V tolerant |
• Bus-pin ESD protection
– 12-kV HBM between bus pins and GND2
– 6-kV HBM between bus pins and GND1 |
• Safety-related certifications:
– 4000-VPK basic insulation, 560 VPK VIORM per
DIN EN IEC 60747-17 (VDE 0884-17)
– 2500 VRMS isolation per UL 1577
– 4000 VPK isolation per CSA 62368-1 |
|
| CATALOG |
| ISO3086DWR COUNTRY OF ORIGIN |
| ISO3086DWR PARAMETRIC INFO |
| ISO3086DWR PACKAGE INFO |
| ISO3086DWR MANUFACTURING INFO |
| ISO3086DWR PACKAGING INFO |
| ISO3086DWR ECAD MODELS |
| ISO3086DWR FUNCTIONAL BLOCK DIAGRAMS |
| ISO3086DWR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Function |
Line Transceiver |
| Number of Transceivers |
1 |
| Number of Transmitters |
1 |
| Number of Receivers |
1 |
| Data Transmission Topology |
Multidrop|Multipoint |
| Transmitter Signal Type |
Differential |
| Receiver Signal Type |
Differential |
| Transmitter Communication Type |
RS-485 |
| Charge Pump |
No |
| Receiver Communication Type |
RS-485 |
| Channel Operating Mode |
Full Duplex |
| Fail Safe |
Open/Short |
| Interface Standards |
EIA/TIA-422|EIA/TIA-485|RS-485 |
| Number of Transmitter Enables |
1 |
| Number of Receiver Enables |
1 |
| Number of Drivers per Line |
1 |
| Number of Receivers per Line |
1 |
| Data Rate |
20Mbps |
| Driving Mode |
3-State |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Dual |
| Typical Dual Supply Voltage (V) |
3.3|5 |
| Maximum Dual Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
15 |
| Isolation |
Yes |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10.5(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.5(Max) |
| Package Overall Width (mm) |
10.63(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-013AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
|
|
| FUNCTIONAL BLOCK DIAGRAMS |
|
|
| APPLICATIONS |
| • Security systems |
| • Chemical production |
| • Factory automation |
| • Motor and motion control |
| • HVAC and building automation networks |
| • Networked security stations |
|