| 
    
    
       
        | 
    
    
      | • Meets or exceeds TIA/EIA RS-485 requirements  | 
    
    
      | • Signaling rates up to 20 Mbps  | 
    
    
      | • 1/8 unit load – up to 256 nodes on a bus  | 
    
    
      | • Thermal shutdown protection  | 
    
    
      | • Low bus capacitance – 16 pF (typical)
        | 
    
    
      | • 50 kV/μs typical transient immunity  | 
    
    
      | • Fail-safe receiver for bus open, short, idle  | 
    
    
      | • 3.3-V inputs are 5-V tolerant | 
    
    
      • Bus-pin ESD protection 
         – 12-kV HBM between bus pins and GND2 
         – 6-kV HBM between bus pins and GND1  | 
    
    
      • Safety-related certifications: 
         – 4000-VPK basic insulation, 560 VPK VIORM per
      DIN EN IEC 60747-17 (VDE 0884-17) 
         – 2500 VRMS isolation per UL 1577 
         – 4000 VPK isolation per CSA 62368-1  | 
    
    
        
       
       | 
    
    
      | CATALOG  | 
    
    
      | ISO3086DWR COUNTRY OF ORIGIN  | 
    
    
      | ISO3086DWR PARAMETRIC INFO  | 
    
    
      | ISO3086DWR PACKAGE INFO  | 
    
    
      | ISO3086DWR MANUFACTURING INFO  | 
    
    
      | ISO3086DWR PACKAGING INFO  | 
    
    
      | ISO3086DWR ECAD MODELS  | 
    
    
      | ISO3086DWR FUNCTIONAL BLOCK DIAGRAMS  | 
    
    
      | ISO3086DWR APPLICATIONS  | 
    
    
        
       
       | 
    
    
      | COUNTRY OF ORIGIN  | 
    
    
      | Taiwan (Province of China)  | 
    
    
        
       
       | 
    
    
      | PARAMETRIC INFO  | 
    
    
      
      
        
          
            | Function | 
            Line Transceiver | 
           
          
            | Number of Transceivers | 
            1 | 
           
          
            | Number of Transmitters | 
            1 | 
           
          
            | Number of Receivers | 
            1 | 
           
          
            | Data Transmission Topology | 
            Multidrop|Multipoint | 
           
          
            | Transmitter Signal Type | 
            Differential | 
           
          
            | Receiver Signal Type | 
            Differential | 
           
          
            | Transmitter Communication Type | 
            RS-485 | 
           
          
            | Charge Pump | 
            No | 
           
          
            | Receiver Communication Type | 
            RS-485 | 
           
          
            | Channel Operating Mode | 
            Full Duplex | 
           
          
            | Fail Safe | 
            Open/Short | 
           
          
            | Interface Standards | 
            EIA/TIA-422|EIA/TIA-485|RS-485 | 
           
          
            | Number of Transmitter Enables | 
            1 | 
           
          
            | Number of Receiver Enables | 
            1 | 
           
          
            | Number of Drivers per Line | 
            1 | 
           
          
            | Number of Receivers per Line | 
            1 | 
           
          
            | Data Rate | 
            20Mbps | 
           
          
            | Driving Mode | 
            3-State | 
           
          
            | Minimum Operating Temperature (°C) | 
            -40 | 
           
          
            | Maximum Operating Temperature (°C) | 
            85 | 
           
          
            | Supplier Temperature Grade | 
            Industrial | 
           
          
            | Maximum Storage Temperature (°C) | 
            150 | 
           
          
            | Minimum Storage Temperature (°C) | 
            -65 | 
           
          
            | Power Supply Type | 
            Dual | 
           
          
            | Typical Dual Supply Voltage (V) | 
            3.3|5 | 
           
          
            | Maximum Dual Supply Voltage (V) | 
            5.5 | 
           
          
            | Maximum Supply Current (mA) | 
            15 | 
           
          
            | Isolation | 
            Yes | 
           
        
       
        | 
    
    
      |   | 
    
    
      | PACKAGE INFO  | 
    
    
      
      
        
          
            | Supplier Package | 
            SOIC | 
           
          
            | Basic Package Type | 
            Lead-Frame SMT | 
           
          
            | Pin Count | 
            16 | 
           
          
            | Lead Shape | 
            Gull-wing | 
           
          
            | PCB | 
            16 | 
           
          
            | Tab | 
            N/R | 
           
          
            | Pin Pitch (mm) | 
            1.27 | 
           
          
            | Package Length (mm) | 
            10.5(Max) | 
           
          
            | Package Width (mm) | 
            7.6(Max) | 
           
          
            | Package Height (mm) | 
            2.35(Max) | 
           
          
            | Package Diameter (mm) | 
            N/R | 
           
          
            | Package Overall Length (mm) | 
            10.5(Max) | 
           
          
            | Package Overall Width (mm) | 
            10.63(Max) | 
           
          
            | Package Overall Height (mm) | 
            2.65(Max) | 
           
          
            | Seated Plane Height (mm) | 
            2.65(Max) | 
           
          
            | Mounting | 
            Surface Mount | 
           
          
            | Package Weight (g) | 
            N/A | 
           
          
            | Package Material | 
            Plastic | 
           
          
            | Package Description | 
            Small Outline IC | 
           
          
            | Package Family Name | 
            SO | 
           
          
            | Jedec | 
            MS-013AA | 
           
          
            | Package Outline | 
            Link to Datasheet | 
           
        
       
        | 
    
    
      |   | 
    
    
      | MANUFACTURING INFO  | 
    
    
      
      
        
          
            | MSL | 
            2 | 
           
          
            | Maximum Reflow Temperature (°C) | 
            260 | 
           
          
            | Reflow Solder Time (Sec) | 
            30 | 
           
          
            | Number of Reflow Cycle | 
            3 | 
           
          
            | Standard | 
            J-STD-020D | 
           
          
            | Reflow Temp. Source | 
            Link to Datasheet | 
           
          
            | Maximum Wave Temperature (°C) | 
            N/R | 
           
          
            | Wave Solder Time (Sec) | 
            N/R | 
           
          
            | Lead Finish(Plating) | 
            Au | 
           
          
            | Under Plating Material | 
            Pd over Ni | 
           
          
            | Terminal Base Material | 
            Cu Alloy | 
           
        
       
        | 
    
    
      |   | 
    
    
      | PACKAGING INFO  | 
    
    
      
      
        
          
            | Packaging Suffix | 
            R | 
           
          
            | Packaging | 
            Tape and Reel | 
           
          
            | Quantity Of Packaging | 
            2000 | 
           
          
            | Reel Diameter (in) | 
            13 | 
           
          
            | Reel Width (mm) | 
            16.4 | 
           
          
            | Tape Pitch (mm) | 
            12 | 
           
          
            | Tape Width (mm) | 
            16 | 
           
          
            | Component Orientation | 
            Q1 | 
           
          
            | Packaging Document | 
            Link to Datasheet | 
           
        
       
        | 
    
    
      |   | 
    
    
      | ECAD MODELS  | 
    
    
         | 
    
    
        
       
       | 
    
    
      | FUNCTIONAL BLOCK DIAGRAMS  | 
    
    
         | 
    
    
        
       
       | 
    
    
      | APPLICATIONS  | 
    
    
      | • Security systems  | 
    
    
      | • Chemical production  | 
    
    
      | • Factory automation  | 
    
    
      | • Motor and motion control  | 
    
    
      | • HVAC and building automation networks  | 
    
    
      | • Networked security stations  | 
    
    
        
       
       |