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• Meets or exceeds TIA/EIA RS-485 requirements |
• Signaling rates up to 20 Mbps |
• 1/8 unit load – up to 256 nodes on a bus |
• Thermal shutdown protection |
• Low bus capacitance – 16 pF (typical)
|
• 50 kV/μs typical transient immunity |
• Fail-safe receiver for bus open, short, idle |
• 3.3-V inputs are 5-V tolerant |
• Bus-pin ESD protection
– 12-kV HBM between bus pins and GND2
– 6-kV HBM between bus pins and GND1 |
• Safety-related certifications:
– 4000-VPK basic insulation, 560 VPK VIORM per
DIN EN IEC 60747-17 (VDE 0884-17)
– 2500 VRMS isolation per UL 1577
– 4000 VPK isolation per CSA 62368-1 |
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CATALOG |
ISO3086DWR COUNTRY OF ORIGIN |
ISO3086DWR PARAMETRIC INFO |
ISO3086DWR PACKAGE INFO |
ISO3086DWR MANUFACTURING INFO |
ISO3086DWR PACKAGING INFO |
ISO3086DWR ECAD MODELS |
ISO3086DWR FUNCTIONAL BLOCK DIAGRAMS |
ISO3086DWR APPLICATIONS |
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
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PARAMETRIC INFO |
Function |
Line Transceiver |
Number of Transceivers |
1 |
Number of Transmitters |
1 |
Number of Receivers |
1 |
Data Transmission Topology |
Multidrop|Multipoint |
Transmitter Signal Type |
Differential |
Receiver Signal Type |
Differential |
Transmitter Communication Type |
RS-485 |
Charge Pump |
No |
Receiver Communication Type |
RS-485 |
Channel Operating Mode |
Full Duplex |
Fail Safe |
Open/Short |
Interface Standards |
EIA/TIA-422|EIA/TIA-485|RS-485 |
Number of Transmitter Enables |
1 |
Number of Receiver Enables |
1 |
Number of Drivers per Line |
1 |
Number of Receivers per Line |
1 |
Data Rate |
20Mbps |
Driving Mode |
3-State |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Power Supply Type |
Dual |
Typical Dual Supply Voltage (V) |
3.3|5 |
Maximum Dual Supply Voltage (V) |
5.5 |
Maximum Supply Current (mA) |
15 |
Isolation |
Yes |
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PACKAGE INFO |
Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
Gull-wing |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
10.5(Max) |
Package Width (mm) |
7.6(Max) |
Package Height (mm) |
2.35(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
10.5(Max) |
Package Overall Width (mm) |
10.63(Max) |
Package Overall Height (mm) |
2.65(Max) |
Seated Plane Height (mm) |
2.65(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-013AA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO |
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.4 |
Tape Pitch (mm) |
12 |
Tape Width (mm) |
16 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAMS |
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APPLICATIONS |
• Security systems |
• Chemical production |
• Factory automation |
• Motor and motion control |
• HVAC and building automation networks |
• Networked security stations |
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