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• 50kV/μs Typical Transient Immunity
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• 4kV ESD Protection
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• –40°C to +125°C Operating Range
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• Operates with 2.8V (C-Grade),3.3V, or 5V Supplies
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|
| CATALOG |
ISO7221CQDRQ1 COUNTRY OF ORIGIN
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ISO7221CQDRQ1 PARAMETRIC INFO
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ISO7221CQDRQ1 PACKAGE INFO
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ISO7221CQDRQ1 MANUFACTURING INFO
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ISO7221CQDRQ1 PACKAGING INFO
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ISO7221CQDRQ1 ECAD MODELS
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ISO7221CQDRQ1 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Malaysia
|
|
PARAMETRIC INFO
|
| Number of Channels per Chip |
2 |
| Type |
General Purpose |
| Isolated Power |
No |
| Output Type |
Logic |
| Minimum Isolation Voltage (Vrms) |
4000 |
| Maximum Pulse Width Distortion (ns) |
3 |
| Minimum Common Mode Rejection (kV/us) |
25 |
| Maximum Working Insulation Voltage |
560Vp |
| Maximum Fall Time (ns) |
2(Typ) |
| Maximum Rise Time (ns) |
2(Typ) |
| Maximum Propagation Delay Time (tPHL) (ns) |
42 |
| Maximum Propagation Delay Time (tPLH) (ns) |
52 |
| Maximum Data Rate |
25Mbps |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Coupling Type |
Capacitive Coupling |
| Maximum Quiescent Supply Current (mA) |
2/31 |
| Forward/Reverse Channels |
1/1 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
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| APPLICATIONS |
| • Factory Automation– Modbus– Profibus™– DeviceNet™ Data Buses |
| • Computer Peripheral Interface |
| • Servo Control Interface |
| • Data Acquisition |
| |
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