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• 100Mbps data rate
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• Wide supply range: 2.25V to 5.5V
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• 2.25V to 5.5V level translation
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• Default output high (ISO774x ) and low (ISO774xF) options
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• Wide temperature range: –55°C to 125°C
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• Low power consumption, typical 1.5mA per channel at 1Mbps
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• Low propagation delay: 10.7ns typical(5V Supplies)
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• Wide-SOIC (DW-16) and QSOP (DBQ-16) package options
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| CATALOG |
ISO7741FBDWR COUNTRY OF ORIGIN
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ISO7741FBDWR PARAMETRIC INFO
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ISO7741FBDWR PACKAGE INFO
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ISO7741FBDWR MANUFACTURING INFO
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ISO7741FBDWR PACKAGING INFO
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ISO7741FBDWR ECAD MODELS
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ISO7741FBDWR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Malaysia
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|
PARAMETRIC INFO
|
| Number of Channels per Chip |
4 |
| Type |
General Purpose |
| Isolated Power |
Yes |
| Output Type |
Logic |
| Minimum Isolation Voltage (Vrms) |
5000 |
| Maximum Power Dissipation (mW) |
210 |
| Maximum Pulse Width Distortion (ns) |
5.9 |
| Minimum Common Mode Rejection (kV/us) |
85 |
| Maximum Working Insulation Voltage |
2121Vp |
| Maximum Fall Time (ns) |
3.9 |
| Maximum Rise Time (ns) |
3.9 |
| Maximum Propagation Delay Time (tPHL) (ns) |
21 |
| Maximum Propagation Delay Time (tPLH) (ns) |
21 |
| Maximum Data Rate |
100Mbps |
| Minimum Operating Supply Voltage (V) |
2.25 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Output Current Drive (mA) |
15 |
| Coupling Type |
Capacitive Coupling |
| Forward/Reverse Channels |
3/1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10.5(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.5(Max) |
| Package Overall Width (mm) |
10.63(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-013AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
2.35 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
10.5 |
| Minimum PACKAGE_DIMENSION_L |
10.1 |
| Maximum PACKAGE_DIMENSION_W |
7.6 |
| Minimum PACKAGE_DIMENSION_W |
7.4 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
2.65 |
| Minimum Seated_Plane_Height |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Industrial automation |
| • Motor control |
| • Power supplies |
| |
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