Japan plans to mass produce 2nm chips, focusing on 2.5D and 3D packaging heterogeneous technologies

Japan has set a goal to mass produce chips with a 2nm process in the future. According to the DigiTimes, Japan is not only trying to improve the transistor density of a single chip, but also plans to use heterogeneous technology for 2nm chips to combine multiple chips.

Since its establishment in August 2022, Japanese semiconductor company Rapidus has been focusing on heterogeneous integration technology, attempting to combine multiple different chips together through 2.5D and 3D packaging. According to Rapidus' official website, the company plans to collaborate with Western companies to develop the next generation 3D LSI (Large Scale Integrated Circuit) and mass produce 2nm and below process chips using leading technology.

In June 2023, the Ministry of Economy, Trade and Industry of Japan revised the "Semiconductor and Digital Industry Strategy" to identify 2.5D, 3D packaging, and silicon bridge technology as technologies that need to achieve breakthroughs before the end of 2020. The goal of the Ministry of Economy and Industry is to launch the Advanced Semiconductor Technology Center (LSTC), collaborate with Rapidus and overseas research institutions and manufacturers to jointly develop these technologies, and apply advanced packaging technologies to chips at 2nm and below.