
|
|
CATALOG |
KAT-15+ COUNTRY OF ORIGIN
|
KAT-15+ PARAMETRIC INFO
|
KAT-15+ PACKAGE INFO
|
KAT-15+ MANUFACTURING INFO
|
KAT-15+ PACKAGING INFO
|
KAT-15+ APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Malaysia
|
|
PARAMETRIC INFO
|
Module/IC Classification |
IC |
Manufacture Type |
Fixed Attenuator |
Maximum Attenuation (dB) |
16 |
Minimum Frequency (GHz) |
0 |
Maximum Frequency (GHz) |
43.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Typical Attenuation (dB) |
14.6 |
Maximum VSWR |
1.9 |
Maximum Input Power |
1.4W |
Impedance (Ohm) |
50 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
Case MC-1630-1 |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
No Lead |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
2 |
Package Width (mm) |
2 |
Package Height (mm) |
1(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2 |
Package Overall Width (mm) |
2 |
Package Overall Height (mm) |
1.05(Max) |
Seated Plane Height (mm) |
1.05(Max) |
Mounting |
Surface Mount |
Terminal Width (mm) |
0.25 |
Package Weight (g) |
0.006 |
Package Material |
Plastic |
Package Description |
N/A |
Package Family Name |
N/A |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000|2000|3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
• 5G
|
• Test and Measurement
|
• Radar
|
• Communication |
• Defense |
|