KSZ9031RNXIC Microchip Technology IC TXRX 4/4 ETHERNET FULL 48QFN

label:
2024/01/30 324



• Single-Chip 10/100/1000 Mbps Ethernet Transceiver Suitable for IEEE 802.3 Applications
• RGMII Timing Supports On-Chip Delay According to RGMII Version 2.0, with Programming Options for External Delay and Making Adjustments and Corrections to TX and RX Timing Paths
• RGMII with 3.3V/2.5V/1.8V Tolerant I/Os
• Auto-Negotiation to Automatically Select the Highest Link-Up Speed (10/100/1000 Mbps) and Duplex (Half/Full)
• On-Chip Termination Resistors for the Differential Pairs
• On-Chip LDO Controller to Support Single 3.3V Supply Operation – Requires Only One External FET to Generate 1.2V for the Core
• Jumbo Frame Support up to 16 KB
• 125 MHz Reference Clock Output


CATALOG
KSZ9031RNXIC COUNTRY OF ORIGIN
KSZ9031RNXIC PARAMETRIC INFO
KSZ9031RNXIC PACKAGE INFO
KSZ9031RNXIC MANUFACTURING INFO
KSZ9031RNXIC PACKAGING INFO
KSZ9031RNXIC ECAD MODELS
KSZ9031RNXIC APPLICATIONS


COUNTRY OF ORIGIN
China
Thailand
Taiwan (Province of China)


PARAMETRIC INFO
Type Gigabit Ethernet Transceiver
Maximum Data Rate 1Gbps
Number of Channels per Chip 1
PHY Line Side Interface No
JTAG Support No
Standard Supported 10BASE-T|100BASE-TX|1000BASE-T|IEEE 802.3
Typical Data Rate (Mbps) 10/100/1000
Integrated CDR No
Overhead Octet Support No
Ethernet Interface Type RGMII
Ethernet Speed 10Mbps/100Mbps/1000Mbps
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
Power Supply Type Analog|Digital
Typical Operating Supply Voltage (V) 1.8|2.5|3.3
Minimum Operating Supply Voltage (V) 1.14|1.71|2.375|3.135
Maximum Operating Supply Voltage (V) 1.38|1.89|2.625|3.465
Operating Supply Voltage (V) 1.8|2.5|3.3
Maximum Supply Current (mA) 221(Typ)


PACKAGE INFO
Supplier Package VQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 48
Lead Shape No Lead
PCB 48
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 0.85(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 7
Package Overall Width (mm) 7
Package Overall Height (mm) 0.85
Seated Plane Height (mm) 0.85
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 260


ECAD MODELS



APPLICATIONS
• Laser/Network Printer
• Network Attached Storage (NAS)
• Network Server
• Gigabit LAN on Motherboard (GLOM)
• Broadband Gateway
• Gigabit SOHO/SMB Router 
• IPTV
• IP Set-Top Box
• Game Console
• Triple-Play (Data, Voice, Video) Media Center
• Industrial Control
• Automotive In-Vehicle Networking
Продукт RFQ