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• Single-Chip 10/100/1000 Mbps Ethernet Transceiver Suitable for IEEE 802.3 Applications
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• RGMII Timing Supports On-Chip Delay According
to RGMII Version 2.0, with Programming Options
for External Delay and Making Adjustments and
Corrections to TX and RX Timing Paths
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• RGMII with 3.3V/2.5V/1.8V Tolerant I/Os
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• Auto-Negotiation to Automatically Select the
Highest Link-Up Speed (10/100/1000 Mbps) and
Duplex (Half/Full)
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• On-Chip Termination Resistors for the Differential
Pairs |
• On-Chip LDO Controller to Support Single 3.3V
Supply Operation – Requires Only One External
FET to Generate 1.2V for the Core |
• Jumbo Frame Support up to 16 KB
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• 125 MHz Reference Clock Output
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CATALOG |
KSZ9031RNXIC COUNTRY OF ORIGIN |
KSZ9031RNXIC PARAMETRIC INFO
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KSZ9031RNXIC PACKAGE INFO
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KSZ9031RNXIC MANUFACTURING INFO
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KSZ9031RNXIC PACKAGING INFO
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KSZ9031RNXIC ECAD MODELS
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KSZ9031RNXIC APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Thailand |
Taiwan (Province of China) |
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PARAMETRIC INFO
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Type |
Gigabit Ethernet Transceiver |
Maximum Data Rate |
1Gbps |
Number of Channels per Chip |
1 |
PHY Line Side Interface |
No |
JTAG Support |
No |
Standard Supported |
10BASE-T|100BASE-TX|1000BASE-T|IEEE 802.3 |
Typical Data Rate (Mbps) |
10/100/1000 |
Integrated CDR |
No |
Overhead Octet Support |
No |
Ethernet Interface Type |
RGMII |
Ethernet Speed |
10Mbps/100Mbps/1000Mbps |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-55 |
Power Supply Type |
Analog|Digital |
Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
Minimum Operating Supply Voltage (V) |
1.14|1.71|2.375|3.135 |
Maximum Operating Supply Voltage (V) |
1.38|1.89|2.625|3.465 |
Operating Supply Voltage (V) |
1.8|2.5|3.3 |
Maximum Supply Current (mA) |
221(Typ) |
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PACKAGE INFO
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Supplier Package |
VQFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
48 |
Lead Shape |
No Lead |
PCB |
48 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
7 |
Package Width (mm) |
7 |
Package Height (mm) |
0.85(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
7 |
Package Overall Width (mm) |
7 |
Package Overall Height (mm) |
0.85 |
Seated Plane Height (mm) |
0.85 |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Package Outline |
Link to Datasheet |
|
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MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
10 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tray |
Quantity Of Packaging |
260 |
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ECAD MODELS
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APPLICATIONS
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• Laser/Network Printer
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• Network Attached Storage (NAS)
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• Network Server
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• Gigabit LAN on Motherboard (GLOM)
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• Broadband Gateway
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• Gigabit SOHO/SMB Router
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• IPTV |
• IP Set-Top Box |
• Game Console |
• Triple-Play (Data, Voice, Video) Media Center |
• Industrial Control |
• Automotive In-Vehicle Networking |
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