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■ High accuracy and reliability
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■ Positive temperature coefficient;fail-safe behavior
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■ Long-term stability
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■ Virtually linear characteristics
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| CATALOG |
KTY81/210,112 Country of Origin
|
KTY81/210,112 Lifecycle
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KTY81/210,112 Parametric Info
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KTY81/210,112 Package Info
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KTY81/210,112 Manufacturing Info
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KTY81/210,112 Packaging Info
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COUNTRY OF ORIGIN
|
Philippines
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Malaysia
|
China
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LIFECYCLE
|
Obsolete
Dec 31,2023
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PARAMETRIC INFO
|
| Function |
Temperature Sensor |
| Minimum Temperature Sensing (°C) |
-55 |
| Maximum Temperature Sensing (°C) |
150 |
| Operating Temperature (°C) |
-55 to 150 |
| Operating Range |
-55°C to 150°C |
| Maximum Supply Current (uA) |
10000 |
| Accuracy |
±1.27K |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
PBCYT |
| Basic Package Type |
Through Hole |
| Pin Count |
2 |
| Lead Shape |
Through Hole |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
4.8(Max) |
| Package Width (mm) |
4.2(Max) |
| Package Height (mm) |
5.2(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
7.7(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
N/A |
| Jedec |
N/A |
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MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
|
| Packaging Suffix |
112 |
| Packaging |
Bulk |
| Quantity Of Packaging |
4000(Min) |
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