
|
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• AEC-Q100 qualified |
• Operating DC supply voltage range
5.6 V to 40 V |
• Low dropout voltage |
• Low quiescent current |
• Precision output voltage 5 V ±2% |
• Very wide stability range with low value output
capacitor |
• Thermal shutdown and short-circuit protection
|
• Wide temperature range (Tj
= -40 °C to 150 °C) |
|
CATALOG |
L5150BNTR COUNTRY OF ORIGIN |
L5150BNTR PARAMETRIC INFO |
L5150BNTR PACKAGE INFO |
L5150BNTR MANUFACTURING INFO |
L5150BNTR PACKAGING INFO |
L5150BNTR ECAD MODELS |
L5150BNTR FUNCTONAL BLOCK DIAGRAM |
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COUNTRY OF ORIGIN |
China |
|
PARAMETRIC INFO |
Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.15 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to Ambient |
79K/W |
Junction to Case |
20K/W |
Polarity |
Positive |
Special Features |
Current Limit|Short Circuit Protection|Thermal Shutdown Protection |
Load Regulation |
40mV |
Line Regulation |
40mV |
Maximum Quiescent Current (mA) |
0.05 |
Maximum Dropout Voltage @ Current (V) |
0.5@150mA |
Maximum Input Voltage (V) |
40 |
Output Voltage (V) |
5 |
Typical Quiescent Current (mA) |
0.05 |
Accuracy (%) |
±2 |
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PACKAGE INFO |
Supplier Package |
SOT-223 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
4 |
Lead Shape |
Gull-wing |
PCB |
3 |
Tab |
Tab |
Pin Pitch (mm) |
2.3 |
Package Length (mm) |
6.5 |
Package Width (mm) |
3.5 |
Package Height (mm) |
1.8(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.9(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
TO-261AA |
Package Outline |
Link to Datasheet |
|
MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
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PACKAGING INFO |
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
Packaging Document |
Link to Datasheet |
|
ECAD MODELS |
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FUNCTONAL BLOCK DIAGRAM |

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