|
|
■ 2 A DC output current
|
■ 4.5 V to 61 V operating input voltage
|
■ RDS,ON = 300 mΩ typ
|
■ Adjustable fSW (250 kHz - 1.5 MHz)
|
■ Low IQ-SHD (11 µA typ. from VIN)
|
■ Low IQ (1 mA typ. - VIN 24 V - VOUT 3.3 V)
|
■ Output voltage adjustable from 0.8 V to VIN
|
■ Synchronization
|
■ Adjustable soft-start time
|
■ Adjustable current limitation
|
■ Advanced bootstrap capacitor management for
LDO operation
|
■ VBIAS improves efficiency at light load
|
■ PGOOD open collector output
|
■ Output voltage sequencing
|
■ Digital frequency foldback in short-circuit
|
■ Peak current foldback in short-circuit
|
■ Auto-recovery thermal shutdown
|
|
| CATALOG |
| L7987LTR COUNTRY OF ORIGIN |
L7987LTR PARAMETRIC INFO
|
L7987LTR PACKAGE INFO
|
L7987LTR MANUFACTURING INFO
|
| L7987LTR PACKAGING INFO
|
L7987LTR ECAD MODELS
|
L7987LTR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Malaysia |
Philippines
|
China
|
|
PARAMETRIC INFO
|
| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
61 |
| Output Voltage (V) |
0.8 to 61 |
| Maximum Output Current (A) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switching Frequency (kHz) |
1650 |
| Switching Regulator |
Yes |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
2500 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
2.7 |
|
|
PACKAGE INFO
|
| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SOP |
| Jedec |
MO-153ABT |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Designed for 24 V bus
|
• Fail safe tolerant systems
|
• Programmable logic controllers (PLCs)
|
| |
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