 |
|
| • Single-Chip Ethernet Physical Layer Transceiver
(PHY) |
• Comprehensive flexPWR® Technology
— Flexible Power Management Architecture
— LVCMOS Variable I/O voltage range: +1.6V to +3.6V
— Integrated 1.2V regulator |
| • HP Auto-MDIX support |
| • Miniature 24-pin QFN lead-free RoHS compliant
package (4 x 4 x 0.85mm height). |
|
| CATALOG |
| LAN8720AI-CP-ABC COUNTRY OF ORIGIN |
| LAN8720AI-CP-ABC PARAMETRIC INFO |
| LAN8720AI-CP-ABC PACKAGE INFO |
| LAN8720AI-CP-ABC MANUFACTURING INFO |
| LAN8720AI-CP-ABC PACKAGING INFO |
| LAN8720AI-CP-ABC ECAD MODELS |
| LAN8720AI-CP-ABC APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Singapore |
| Malaysia |
| China |
| United States of America |
|
| PARAMETRIC INFO |
| Type |
Fast Ethernet Transceiver |
| Maximum Data Rate |
100Mbps |
| Number of Channels per Chip |
1 |
| PHY Line Side Interface |
No |
| JTAG Support |
No |
| Standard Supported |
10BASE-T|100BASE-TX|IEEE 802.3 |
| Typical Data Rate (Mbps) |
10/100 |
| Integrated CDR |
No |
| Number of Transceivers |
1 |
| Overhead Octet Support |
No |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Minimum Operating Supply Voltage (V) |
1.14|2.25|3 |
| Maximum Operating Supply Voltage (V) |
1.26|3.6 |
| Operating Supply Voltage (V) |
2.5|3.3 |
|
|
| PACKAGE INFO |
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
490 |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Set-Top Boxes |
| • Networked Printers and Servers |
| • Test Instrumentation |
| • LAN on Motherboard |
| • Embedded Telecom Applications |
| • Video Record/Playback Systems |
| • Cable Modems/Routers |
| • DSL Modems/Routers |
| • Digital Video Recorders |
| • IP and Video Phones |
| • Wireless Access Points |
| • Digital Televisions |
| • Digital Media Adaptors/Servers |
| • Gaming Consoles |
| • POE Applications (Refer to SMSC Application Note 17.18) |
| |
| |
One-stop supplier of IC products