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• Single-Chip Ethernet Physical Layer Transceiver(PHY)
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• Comprehensive flexPWR® Technology
— Flexible Power Management Architecture
— LVCMOS Variable I/O voltage range: +1.6V to +3.6V
— Integrated 1.2V regulator
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• HP Auto-MDIX support
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• Miniature 24-pin QFN lead-free RoHS compliantpackage (4 x 4 x 0.85mm height).
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| CATALOG |
LAN8720AI-CP-TR Country of Origin
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LAN8720AI-CP-TR Parametric Info
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LAN8720AI-CP-TR Package Info
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LAN8720AI-CP-TR Manufacturing Info
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LAN8720AI-CP-TR Packaging Info
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LAN8720AI-CP-TR ECAD Models
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LAN8720AI-CP-TR Applications
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COUNTRY OF ORIGIN
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China
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United States of America
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Korea (Republic of)
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Singapore
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PARAMETRIC INFO
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| Type |
Fast Ethernet Transceiver |
| Maximum Data Rate |
100Mbps |
| Number of Channels per Chip |
2 |
| PHY Line Side Interface |
No |
| JTAG Support |
No |
| Standard Supported |
10BASE-T|100BASE-TX|IEEE 802.3|IEEE 802.3u|ISO 802-3 |
| Typical Data Rate (Mbps) |
10/100 |
| Integrated CDR |
No |
| Number of Transceivers |
1 |
| Overhead Octet Support |
No |
| Maximum Power Dissipation (mW) |
179 |
| Ethernet Interface Type |
RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Process Technology |
CMOS |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
1.2|1.8|2.5|3.3 |
| Minimum Operating Supply Voltage (V) |
1.08|1.62|2.25|3 |
| Maximum Operating Supply Voltage (V) |
1.32|3.6 |
| Operating Supply Voltage (V) |
1.2|1.8|2.5|3.3 |
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PACKAGE INFO
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| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Set-Top Boxes
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• Networked Printers and Servers
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• Test Instrumentation
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• LAN on Motherboard
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• Embedded Telecom Applications
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• Video Record/Playback Systems
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• Cable Modems/Routers
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• DSL Modems/Routers
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• Digital Video Recorders
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• IP and Video Phones
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• Wireless Access Points
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• Digital Televisions
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• Digital Media Adaptors/Servers
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• Gaming Consoles
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• POE Applications (Refer to SMSC Application Note 17.18)
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