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• 3750Vrms Input/Output Isolation
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• 100% Solid State
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• Low Drive Power Requirements
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• FCC Compatible
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• VDE Compatible
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• No EMI/RFI Generation
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• Flammability Rating UL 94 V-0
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CATALOG |
LBA110S COUNTRY OF ORIGIN
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LBA110S PARAMETRIC INFO
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LBA110S PACKAGE INFO
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LBA110S MANUFACTURING INFO
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LBA110S PACKAGING INFO
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LBA110S APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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PARAMETRIC INFO
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Input Type |
DC |
Maximum Input Voltage (V) |
1.4 |
Maximum Output Voltage (V) |
350 |
Maximum Input Current (mA) |
50 |
Maximum Output Current (A) |
0.12 |
I/O Isolation Voltage (V) |
3750(RMS) |
Output Device |
MOSFET |
Output Type |
AC|DC |
Maximum On Resistance (Ohm) |
35 |
Circuit Arrangement |
1 Form A|1 Form B |
Minimum Input Voltage (V) |
0.9 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
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PACKAGE INFO
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Supplier Package |
PDIP SMD |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
9.65 |
Package Width (mm) |
6.35 |
Package Height (mm) |
3.3 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
4.45 |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Surface Mount Plastic Dual In Line Package |
Package Family Name |
DIP |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
250 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
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PACKAGING INFO
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APPLICATIONS
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• Telecommunications
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• Instrumentation |
• Multiplexers |
• Data Acquisition |
• Electronic Switching |
• I/O Subsystems |
• Meters (Watt-Hour, Water, Gas) |
• Medical Equipment-Patient/Equipment Isolation |
• Security |
• Industrial Controls |
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