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• 3750Vrms Input/Output Isolation
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• 100% Solid State
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• Low Drive Power Requirements
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• FCC Compatible
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• VDE Compatible
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• No EMI/RFI Generation
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• Flammability Rating UL 94 V-0
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| CATALOG |
LBA110S COUNTRY OF ORIGIN
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LBA110S PARAMETRIC INFO
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LBA110S PACKAGE INFO
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LBA110S MANUFACTURING INFO
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LBA110S PACKAGING INFO
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LBA110S APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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PARAMETRIC INFO
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| Input Type |
DC |
| Maximum Input Voltage (V) |
1.4 |
| Maximum Output Voltage (V) |
350 |
| Maximum Input Current (mA) |
50 |
| Maximum Output Current (A) |
0.12 |
| I/O Isolation Voltage (V) |
3750(RMS) |
| Output Device |
MOSFET |
| Output Type |
AC|DC |
| Maximum On Resistance (Ohm) |
35 |
| Circuit Arrangement |
1 Form A|1 Form B |
| Minimum Input Voltage (V) |
0.9 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
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|
PACKAGE INFO
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| Supplier Package |
PDIP SMD |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
9.65 |
| Package Width (mm) |
6.35 |
| Package Height (mm) |
3.3 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
4.45 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Surface Mount Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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APPLICATIONS
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• Telecommunications
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| • Instrumentation |
| • Multiplexers |
| • Data Acquisition |
| • Electronic Switching |
| • I/O Subsystems |
| • Meters (Watt-Hour, Water, Gas) |
| • Medical Equipment-Patient/Equipment Isolation |
| • Security |
| • Industrial Controls |
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