LCMXO2-1200HC-4SG32C Lattice IC FPGA 21 I/O 32QFN

label:
2024/08/9 247
LCMXO2-1200HC-4SG32C Lattice IC FPGA 21 I/O 32QFN


• Flexible Logic Architecture
• Ultra Low Power Devices
• Embedded and Distributed Memory
• On-Chip User Flash Memory
• Pre-Engineered Source Synchronous I/O
• High Performance, Flexible I/O Buffer


CATALOG
LCMXO2-1200HC-4SG32C COUNTRY OF ORIGIN
LCMXO2-1200HC-4SG32C PARAMETRIC INFO
LCMXO2-1200HC-4SG32C PACKAGE INFO
LCMXO2-1200HC-4SG32C PACKAGING INFO
LCMXO2-1200HC-4SG32C ECAD MODELS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Device Logic Units 1280
Device Logic Cells 1280
Maximum Number of User I/Os 21
Number of I/O Banks 4
Device Number of DLLs/PLLs 1
Maximum Differential I/O Pairs 10
RAM Bits (Kbit) 64
Total Number of Block RAM 7
Program Memory Type SRAM
Maximum Distributed RAM Bits 10240
Family Name MachXO2
Process Technology 65nm
Speed Grade 4
Shift Registers Utilize Memory
In-System Programmability No
Reprogrammability Support No
Maximum Operating Supply Voltage (V) 3.6
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Temperature Flag Jun
Supplier Temperature Grade Commercial
Digital Control Impedance No
Minimum Operating Supply Voltage (V) 2.375
Typical Operating Supply Voltage (V) 2.5|3.3
Typical Supply Current (mA) 3.49


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 5
Package Width (mm) 5
Package Height (mm) 0.84
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.85
Mounting Surface Mount
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 490


ECAD MODELS


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