LCMXO2-256HC-4SG32I Lattice IC FPGA 21 I/O 32QFN

label:
2023/11/21 504



CATALOG
LCMXO2-256HC-4SG32I COUNTRY OF ORIGIN
LCMXO2-256HC-4SG32I PARAMETRIC INFO
LCMXO2-256HC-4SG32I PACKAGE INFO
LCMXO2-256HC-4SG32I MANUFACTURING INFO
LCMXO2-256HC-4SG32I PACKAGING INFO
LCMXO2-256HC-4SG32I ECAD MODELS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Device Logic Cells 256
Number of User I/Os 22
Tradename MachXO
Copy Protection No
Number of Global Clocks 8
RAM Bits (Kbit) 0
Program Memory Type Flash
Family Name MachXO2
Process Technology 65nm
Speed Grade 4
Data Gate No
Individual Output Enable Control No
Programmability Yes
In-System Programmability Yes
Reprogrammability Support Yes
Clock Management Multiply|Divide|Phase Shift
Maximum Operating Current (mA) 1.07
Maximum Propagation Delay Time (ns) 7.36
I/O Voltage (V) 1.2|1.5|1.8|2.5|3.3
Minimum Operating Supply Voltage (V) 2.375
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.465
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Temperature Flag Jun
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 155


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 5
Package Width (mm) 5
Package Height (mm) 0.53
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.55
Mounting Surface Mount
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec N/A


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle N/A
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material C 194
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 490


ECAD MODELS

Продукт RFQ