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• Flexible Logic Architecture
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• Ultra Low Power Devices
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• Embedded and Distributed Memory
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• On-Chip User Flash Memory
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• Pre-Engineered Source Synchronous I/O
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• High Performance, Flexible I/O Buffer
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• Flexible On-Chip Clocking
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• Non-volatile, Infinitely Reconfigurable
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| CATALOG |
LCMXO2-4000HC-4FTG256C COUNTRY OF ORIGIN
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LCMXO2-4000HC-4FTG256C PARAMETRIC INFO
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LCMXO2-4000HC-4FTG256C PACKAGE INFO
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LCMXO2-4000HC-4FTG256C MANUFACTURING INFO
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LCMXO2-4000HC-4FTG256C PACKAGING INFO
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LCMXO2-4000HC-4FTG256C ECAD MODELS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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Malaysia
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China
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Japan
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Philippines
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PARAMETRIC INFO
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| Device Logic Cells |
4320 |
| Number of User I/Os |
207 |
| Number of Global Clocks |
8 |
| Tradename |
MachXO |
| Copy Protection |
No |
| RAM Bits (Kbit) |
92 |
| Program Memory Type |
Flash |
| Family Name |
MachXO2 |
| Speed Grade |
4 |
| Data Gate |
No |
| Individual Output Enable Control |
No |
| Programmability |
Yes |
| In-System Programmability |
Yes |
| Reprogrammability Support |
Yes |
| Clock Management |
Multiply|Divide|Phase Shift |
| Maximum Operating Current (mA) |
6.3 |
| Maximum Propagation Delay Time (ns) |
8.05 |
| I/O Voltage (V) |
1.2|1.5|1.8|2.5|3.3 |
| Minimum Operating Supply Voltage (V) |
2.375 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Programmable Type |
In System Programmable |
| Maximum Operating Supply Voltage (V) |
3.465 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Jun |
| Supplier Temperature Grade |
Commercial |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
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PACKAGE INFO
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| Supplier Package |
FTBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
256 |
| Lead Shape |
Ball |
| PCB |
256 |
| Tab |
N/R |
| Pin Pitch (mm) |
1 |
| Package Length (mm) |
17 |
| Package Width (mm) |
17 |
| Package Height (mm) |
1.25(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.4 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Fine Pitch Thin Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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