LD39150DT33-R STMicroelectronics IC REG LINEAR 3.3V 1.5A DPAK

label:
2024/11/19 115
LD39150DT33-R STMicroelectronics IC REG LINEAR 3.3V 1.5A DPAK


• 1.5 A guaranteed output current
• Ultra low dropout voltage (200 mV typ. @ 1.5 A load, 40 mV typ. @ 300 mA load)
• Very low quiescent current (1 mA typ. @ 1.5 A load, 1 µA max @ 25 °C in off mode)
• Logic-controlled electronic shutdown
• Current and thermal internal limit
• 1.5% output voltage tolerance @ 25 °C
• Fixed and ADJ output voltages: 1.8 V, 2.5 V, 3.3 V, ADJ


CATALOG
LD39150DT33-R COUNTRY OF ORIGIN
LD39150DT33-R PARAMETRIC INFO
LD39150DT33-R PACKAGE INFO
LD39150DT33-R MANUFACTURING INFO
LD39150DT33-R PACKAGING INFO
LD39150DT33-R ECAD MODELS
LD39150DT33-R APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 1.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to Ambient 100°C/W
Junction to Case 8°C/W
Polarity Positive
Special Features Current Limit|Thermal Shutdown Protection
Load Regulation 0.06%/A(Typ)
Line Regulation 0.04%(Typ)
Maximum Quiescent Current (mA) 2.5
Maximum Dropout Voltage @ Current (V) 0.08@300mA|0.4@1500mA
Minimum Input Voltage (V) 2.5
Maximum Input Voltage (V) 6
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 1
Typical Dropout Voltage @ Current (V) 0.04@300mA|0.2@1500mA
Reference Voltage (V) 1.22(Typ)
Accuracy (%) ±1.5
Minimum Storage Temperature (°C) -50
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package DPAK
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.3(Max)
Package Length (mm) 6.6(Max)
Package Width (mm) 6.2(Max)
Package Height (mm) 2.4(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6.6(Max)
Package Overall Width (mm) 10.1(Max)
Package Overall Height (mm) 2.63(Max)
Seated Plane Height (mm) 2.63(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Deca Watt Package
Package Family Name TO-252
Jedec TO-252AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Packaging Document Link to Datasheet


ECAD MODELS


APPLICATIONS
• Microprocessor power supply
• DSPs power supply
• Post regulators for switching suppliers
• High efficiency linear regulator
Продукт RFQ