LIS2DE12TR STMicroelectronics ACCEL 2-16G I2C/SPI 12LGA

label:
2024/04/23 272

• Wide supply voltage, 1.71 V to 3.6 V
• Independent IO supply (1.8 V) and supply voltage compatible
• Ultra-low power consumption down to 2 μA
• 2g/±4g/8g/16g selectable full scales
• I2C/SPI digital output interface
• 8-bit data output
• 2 independent programmable interrupt generators for free-fall and motion detection
• 6D/4D orientation detection
• Sleep-to-wake” and “return-to-sleep” functions
• Free-fall detection
• Motion detection
• Embedded temperature sensor
• Embedded FIFO
• ECOPACK®, RoHS and “Green” compliant
CATALOG
LIS2DE12TR COUNTRY OF ORIGIN
LIS2DE12TR PARAMETRIC INFO
LIS2DE12TR PACKAGE INFO
LIS2DE12TR MANUFACTURING INFO
LIS2DE12TR PACKAGING INFO
LIS2DE12TR EACD MODELS
LIS2DE12TR APPLICATIONS


 
COUNTRY OF ORIGIN
Malta


 
PARAMETRIC INFO
Acceleration (g) ±2/±4/±8/±16
Axis Type Triple
Minimum Operating Supply Voltage (V) 1.71
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 125
Supplier Temperature Grade Extended
Output Type Digital
Operating Supply Voltage (V) 1.71 to 3.6
Acceleration Range (g) ±1.5 to ±3|±4 to ±40
Tradename ECOPACK®


 
PACKAGE INFO
Supplier Package LGA
Basic Package Type Non-Lead-Frame SMT
Pin Count 12
Lead Shape No Lead
PCB 12
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 2
Package Width (mm) 2
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2
Package Overall Width (mm) 2
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Description Land Grid Array Package
Package Family Name LGA
Package Outline Link to Datasheet


 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R


 
PACKAGING INFO
Packaging Tape and Reel
Packaging Document Link to Datasheet


 
ECAD MODELS




APPLICATIONS
• Motion-activated functions
• Display orientation
• Shake control
• Pedometer
• Gaming and virtual reality input devices
• Impact recognition and logging

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