 |
|
| • Wide supply voltage, 1.71 V to 3.6 V |
| • Independent IO supply (1.8 V) and supply
voltage compatible |
| • Ultra-low power consumption down to 2 μA |
| • 2g/±4g/8g/16g selectable full scales |
| • I
2C/SPI digital output interface |
| • 2 independent programmable interrupt generators for free-fall and motion detection
|
| • 6D/4D orientation detection |
| • “Sleep-to-wake” and “return-to-sleep” functions |
| • Free-fall detection
|
| • Motion detection |
| • Embedded temperature sensor |
| • Embedded FIFO |
| • ECOPACK®, RoHS and “Green” compliant |
|
| CATALOG |
| LIS2DH12TR COUNTRY OF ORIGIN |
| LIS2DH12TR PARAMETRIC INFO |
| LIS2DH12TR PACKAGE INFO |
| LIS2DH12TR MANUFACTURING INFO |
| LIS2DH12TR PACKAGING INFO |
| LIS2DH12TR ECAD MODELS |
| LIS2DH12TR FUNCTIONAL BLOCK DIAGRAM |
| LIS2DH12TR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Costa Rica |
| Malta |
|
| PARAMETRIC INFO |
| Acceleration (g) |
±2/±4/±8/±16 |
| Axis Type |
Triple |
| Module/IC Classification |
IC |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Output Type |
Digital |
| Operating Supply Voltage (V) |
1.71 to 3.6 |
| Acceleration Range (g) |
±1.5 to ±3|±4 to ±40 |
|
| |
| PACKAGE INFO |
| Supplier Package |
LGA |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
12 |
| Lead Shape |
No Lead |
| PCB |
12 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
2 |
| Package Width (mm) |
2 |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2 |
| Package Overall Width (mm) |
2 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Land Grid Array Package |
| Package Family Name |
LGA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Motion-activated functions |
| • Display orientation |
| • Shake control |
| • Pedometer |
| • Gaming and virtual reality input devices |
| • Impact recognition and logging |
|
One-stop supplier of IC products