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• Wide supply voltage, 1.71 V to 3.6 V
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• Independent IOs supply (1.8 V) and supply voltage compatible
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• Ultra low-power mode consumption down to 2 µA
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| • ±2g/±4g/±8g/±16g dynamically selectable fullscale
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| • I2C/SPI digital output interface |
| • 2 independent programmable interrupt generators for free-fall and motion detection |
| • 6D/4D orientation detection |
| • “Sleep to wake” and “return to sleep” function |
| • Freefall detection |
| • Motion detection |
| • Embedded temperature sensor |
| • Embedded FIFO |
| • ECOPACK® RoHS and “Green” compliant |
| |
| CATALOG |
| LIS2DHTR COUNTRY OF ORIGIN |
LIS2DHTR PARAMETRIC INFO
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LIS2DHTR PACKAGE INFO
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LIS2DHTR MANUFACTURING INFO
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LIS2DHTR PACKAGING INFO
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LIS2DHTR EACD MODELS
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| LIS2DHTR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malta |
|
PARAMETRIC INFO
|
| Acceleration (g) |
±2/±4/±8/±16 |
| Axis Type |
Triple |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
| Supplier Temperature Rating |
Extended |
| Output Type |
Digital |
| Operating Supply Voltage (V) |
1.71 to 3.6 |
| Acceleration Range (g) |
±1.5 to ±3|±4 to ±40 |
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PACKAGE INFO
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| Supplier packaging |
LGA |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
14 |
| Pin shape |
No Lead |
| PCB |
14 |
| ears |
N/R |
| Pin spacing (mm) |
0.35 |
| Package length (mm) |
2 |
| Package width (mm) |
2 |
| Package height (mm) |
1(Max) |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
1(Max) |
| Install |
Surface Mount |
| Packaging materials |
Plastic |
| package instruction |
Land Grid Array Package |
| Package series name |
LGA |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Number of reflow cycles |
3 |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Au |
| Plating materials |
Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Package |
Tape and reel packaging |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Motion activated functions |
| • Display orientation |
| • Shake control |
| • Pedometer |
| • Gaming and virtual reality input devices |
| • Impact recognition and logging |
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