LIS331HHTR STMicroelectronics ACCEL 6-24G I2C/SPI 16LGA

label:
2023/10/19 280



• Wide supply voltage, 2.16 V to 3.6 V
• Low voltage compatible IOs, 1.8 V
• Ultra low-current mode consumption down to 10 µA
• ±6g/±12g/±24g dynamically selectable full scale
• I2C/SPI digital output interface
• 16 bit data output


CATALOG
LIS331HHTR COUNTRY OF ORIGIN
LIS331HHTR PARAMETRIC INFO
LIS331HHTR PACKAGE INFO
LIS331HHTR MANUFACTURING INFO
LIS331HHTR PACKAGING INFO
LIS331HHTR ECAD MODELS
LIS331HHTR APPLICATIONS


COUNTRY OF ORIGIN
China
Malta


PARAMETRIC INFO
Acceleration (g) ±6/±12/±24
Axis Type Triple
Module/IC Classification IC
Minimum Operating Supply Voltage (V) 2.16
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -40
Linearity No
Maximum Storage Temperature (°C) 125
Output Type Digital
Resonant Frequency (kHz) 400(Max)
Operating Supply Voltage (V) 2.16 to 3.6
Acceleration Range (g) ±4 to ±40


PACKAGE INFO
Supplier Package LGA
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Land Grid Array Package
Package Family Name LGA
Jedec N/A


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 1000


ECAD MODELS



APPLICATIONS
• Pedometer
• Gaming and virtual reality input devices
• Motion activated functions
• Impact recognition and logging
• Intelligent power saving for handheld devices
• Vibration monitoring and compensation
Продукт RFQ