
|
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• Wide supply voltage, 2.16 V to 3.6 V
|
• Low voltage compatible IOs, 1.8 V
|
• Ultra low-current mode consumption
down to 10 µA
|
• ±6g/±12g/±24g dynamically selectable full
scale
|
• I2C/SPI digital output interface
|
• 16 bit data output
|
|
| CATALOG |
| LIS331HHTR COUNTRY OF ORIGIN |
LIS331HHTR PARAMETRIC INFO
|
LIS331HHTR PACKAGE INFO
|
LIS331HHTR MANUFACTURING INFO
|
LIS331HHTR PACKAGING INFO
|
LIS331HHTR ECAD MODELS
|
LIS331HHTR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| China |
Malta
|
|
PARAMETRIC INFO
|
| Acceleration (g) |
±6/±12/±24 |
| Axis Type |
Triple |
| Module/IC Classification |
IC |
| Minimum Operating Supply Voltage (V) |
2.16 |
| Typical Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
| Linearity |
No |
| Maximum Storage Temperature (°C) |
125 |
| Output Type |
Digital |
| Resonant Frequency (kHz) |
400(Max) |
| Operating Supply Voltage (V) |
2.16 to 3.6 |
| Acceleration Range (g) |
±4 to ±40 |
|
|
PACKAGE INFO
|
| Supplier Package |
LGA |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Land Grid Array Package |
| Package Family Name |
LGA |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
|
|
ECAD MODELS
|

|
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APPLICATIONS
|
• Pedometer
|
| • Gaming and virtual reality input devices |
• Motion activated functions
|
• Impact recognition and logging
|
• Intelligent power saving for handheld devices
|
• Vibration monitoring and compensation
|
| |