
|
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• Wide supply voltage, 2.16 V to 3.6 V
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• Low voltage compatible IOs, 1.8 V
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• Ultra low-current mode consumption
down to 10 µA
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• ±6g/±12g/±24g dynamically selectable full
scale
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• I2C/SPI digital output interface
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• 16 bit data output
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CATALOG |
LIS331HHTR COUNTRY OF ORIGIN |
LIS331HHTR PARAMETRIC INFO
|
LIS331HHTR PACKAGE INFO
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LIS331HHTR MANUFACTURING INFO
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LIS331HHTR PACKAGING INFO
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LIS331HHTR ECAD MODELS
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LIS331HHTR APPLICATIONS
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COUNTRY OF ORIGIN
|
China |
Malta
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|
PARAMETRIC INFO
|
Acceleration (g) |
±6/±12/±24 |
Axis Type |
Triple |
Module/IC Classification |
IC |
Minimum Operating Supply Voltage (V) |
2.16 |
Typical Operating Supply Voltage (V) |
2.5 |
Maximum Operating Supply Voltage (V) |
3.6 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-40 |
Linearity |
No |
Maximum Storage Temperature (°C) |
125 |
Output Type |
Digital |
Resonant Frequency (kHz) |
400(Max) |
Operating Supply Voltage (V) |
2.16 to 3.6 |
Acceleration Range (g) |
±4 to ±40 |
|
|
PACKAGE INFO
|
Supplier Package |
LGA |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
No Lead |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
3 |
Package Width (mm) |
3 |
Package Height (mm) |
1(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Land Grid Array Package |
Package Family Name |
LGA |
Jedec |
N/A |
|
|
MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
2 Years |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
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ECAD MODELS
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APPLICATIONS
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• Pedometer
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• Gaming and virtual reality input devices |
• Motion activated functions
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• Impact recognition and logging
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• Intelligent power saving for handheld devices
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• Vibration monitoring and compensation
|
|