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| |
• Wide supply voltage, 1.71 V to 3.6 V
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• Independent IO supply (1.8 V) and supply voltage compatible
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• Ultra-low-power mode consumption down to 2 μA
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| • 2g/±4g/8g/16g dynamically selectable full scale |
| • I2C/SPI digital output interface |
| • 16-bit data output |
| • 2 independent programmable interrupt generators for free-fall and motion detection |
| • 6D/4D orientation detection |
| • Free-fall detection |
| |
| CATALOG |
| LIS3DHTR COUNTRY OF ORIGIN |
LIS3DHTR PARAMETRIC INFO
|
LIS3DHTR PACKAGE INFO
|
LIS3DHTR MANUFACTURING INFO
|
LIS3DHTR PACKAGING INFO
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| LIS3DHTR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| United States of America |
| Philippines |
| |
PARAMETRIC INFO
|
| Acceleration (g) |
±2/±4/±8/±16 |
| Axis Type |
Triple |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Linearity |
Yes |
| Maximum Rise Time (ns) |
300 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Fall Time (ns) |
300 |
| Maximum Storage Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Output Type |
Digital |
| Resonant Frequency (kHz) |
400(Max) |
| Operating Supply Voltage (V) |
1.7 to 3.6 |
| Acceleration Range (g) |
±1.5 to ±3|±4 to ±40 |
|
|
PACKAGE INFO
|
| Supplier Package |
LGA |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Land Grid Array Package |
| Package Family Name |
LGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Reel Diameter (in) |
13(Max) |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
|
|
| APPLICATIONS |
| • Motion activated functions |
| • Free-fall detection |
| • Click/double-click recognition |
| • Intelligent power saving for handheld devices |
| • Pedometers |
|
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