|
|
• For a newer drop-in alternative, see the TLV1117 |
• For drop-in replacements in fixed output SOT-223
package configuration and improved functionality,
see the TLV761 |
• Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and adjustable
versions |
• Space-saving SOT-223 and WSON packages |
• Current limiting and thermal protection
|
• Output current: 800 mA |
• Line regulation: 0.2% (maximum) |
• Load regulation: 0.4% (maximum) |
• Temperature range:
– LM1117: 0°C to +125°C
– LM1117I: –40°C to +125°C |
|
CATALOG |
LM1117MPX-3.3/NOPB COUNTRY OF ORIGIN |
LM1117MPX-3.3/NOPB PARAMETRIC INFO |
LM1117MPX-3.3/NOPB PACKAGE INFO |
LM1117MPX-3.3/NOPB MANUFACTURING INFO |
LM1117MPX-3.3/NOPB PACKAGING INFO |
LM1117MPX-3.3/NOPB ECAD MODELS |
LM1117MPX-3.3/NOPB FUNCTIONAL BLOCK DIAGRAM
|
LM1117MPX-3.3/NOPB APPLICATIONS
|
|
COUNTRY OF ORIGIN |
China |
Malaysia |
|
PARAMETRIC INFO |
Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.8 |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to Ambient |
61.6°C/W |
Junction to Case |
42.5°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Thermal Protection |
Load Regulation |
1mV(Typ) |
Line Regulation |
1mV(Typ) |
Maximum Quiescent Current (mA) |
10 |
Maximum Dropout Voltage @ Current (V) |
1.2@100mA|1.25@500mA|1.3@800mA |
Minimum Input Voltage (V) |
2.6 |
Maximum Input Voltage (V) |
15 |
Output Voltage (V) |
3.3 |
Typical Quiescent Current (mA) |
5 |
Typical Dropout Voltage @ Current (V) |
1.1@100mA|1.15@500mA|1.2@800mA |
Accuracy (%) |
±1 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical PSRR (dB) |
75 |
Typical Output Capacitance (uF) |
10(Min) |
Typical Output Noise Voltage (uVrms) |
38 |
Output Capacitor Type |
Tantalum |
|
|
PACKAGE INFO |
Supplier Package |
SOT-223 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
4 |
Lead Shape |
Gull-wing |
PCB |
3 |
Tab |
Tab |
Pin Pitch (mm) |
2.3 |
Package Length (mm) |
6.7(Max) |
Package Width (mm) |
3.7(Max) |
Package Height (mm) |
1.7(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.8(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
TO-261AA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
4 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO |
Packaging Suffix |
X |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.4 |
Tape Pitch (mm) |
12 |
Tape Width (mm) |
16 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS |
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS |
• AC drive power stage modules |
• Merchant network and server PSU |
• Industrial AC/DC |
• Ultrasound scanners |
• Servo drive control modules |
|