LM1117MPX-3.3/NOPB Texas Instruments IC REG LIN 3.3V 800MA SOT223-4

label:
2023/10/27 343


• For a newer drop-in alternative, see the TLV1117
• For drop-in replacements in fixed output SOT-223 package configuration and improved functionality, see the TLV761
• Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and adjustable versions
• Space-saving SOT-223 and WSON packages
• Current limiting and thermal protection  
• Output current: 800 mA
• Line regulation: 0.2% (maximum)
• Load regulation: 0.4% (maximum)
• Temperature range:
   – LM1117: 0°C to +125°C
   – LM1117I: –40°C to +125°C


CATALOG
LM1117MPX-3.3/NOPB COUNTRY OF ORIGIN
LM1117MPX-3.3/NOPB PARAMETRIC INFO
LM1117MPX-3.3/NOPB PACKAGE INFO
LM1117MPX-3.3/NOPB MANUFACTURING INFO
LM1117MPX-3.3/NOPB PACKAGING INFO
LM1117MPX-3.3/NOPB ECAD MODELS  
LM1117MPX-3.3/NOPB FUNCTIONAL BLOCK DIAGRAM  
LM1117MPX-3.3/NOPB APPLICATIONS  


COUNTRY OF ORIGIN
China
Malaysia


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.8
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to Ambient 61.6°C/W
Junction to Case 42.5°C/W
Polarity Positive
Special Features Current Limit|Thermal Protection
Load Regulation 1mV(Typ)
Line Regulation 1mV(Typ)
Maximum Quiescent Current (mA) 10
Maximum Dropout Voltage @ Current (V) 1.2@100mA|1.25@500mA|1.3@800mA
Minimum Input Voltage (V) 2.6
Maximum Input Voltage (V) 15
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 5
Typical Dropout Voltage @ Current (V) 1.1@100mA|1.15@500mA|1.2@800mA
Accuracy (%) ±1
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical PSRR (dB) 75
Typical Output Capacitance (uF) 10(Min)
Typical Output Noise Voltage (uVrms) 38
Output Capacitor Type Tantalum
 
PACKAGE INFO
Supplier Package SOT-223
Basic Package Type Lead-Frame SMT
Pin Count 4
Lead Shape Gull-wing
PCB 3
Tab Tab
Pin Pitch (mm) 2.3
Package Length (mm) 6.7(Max)
Package Width (mm) 3.7(Max)
Package Height (mm) 1.7(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-261AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 4
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/A
 
PACKAGING INFO
Packaging Suffix X
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 12
Tape Width (mm) 16
Component Orientation Q3
Packaging Document Link to Datasheet
 
ECAD MODELS  


FUNCTIONAL BLOCK DIAGRAM  


APPLICATIONS
• AC drive power stage modules
• Merchant network and server PSU
• Industrial AC/DC
• Ultrasound scanners
• Servo drive control modules


Продукт RFQ