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• Rated for −55°C to 130°C Range
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• Available in SC70 and DSBGA Package
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• Predictable Curvature Error
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• Suitable for Remote Applications
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• Accuracy at 30°C ±1.5 to ±4°C (Maximum)
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• Accuracy at 130°C and −55°C ±2.5 to ±5°C (Maximum)
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• Power Supply Voltage Range 2.4 V to 5.5 V
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• Current Drain 10 μA (Maximum)
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• Nonlinearity ±0.4% (Typical)
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• Output Impedance 160 Ω (Maximum)
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| CATALOG |
LM20BIM7X/NOPB COUNTRY OF ORIGIN
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LM20BIM7X/NOPB PARAMETRIC INFO
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LM20BIM7X/NOPB PACKAGE INFO
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LM20BIM7X/NOPB MANUFACTURING INFO
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LM20BIM7X/NOPB PACKAGING INFO
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LM20BIM7X/NOPB ECAD MODELS
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LM20BIM7X/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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| Function |
Temperature Sensor |
| Sensor Gain |
-11.77mV/°C |
| Output Type |
Analog |
| Minimum Operating Supply Voltage (V) |
2.4 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Response Point List |
(-55,2485m),(130,303m) |
| Minimum Temperature Sensing (°C) |
-55 |
| Maximum Temperature Sensing (°C) |
130 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Output Voltage (V) |
1.8639(Typ) |
| Minimum Output Voltage (V) |
-0.6 |
| Topology |
v(1,1) |
| Operating Range |
-55°C to 130°C |
| Operating Temperature (°C) |
-55 to 130 |
| Process Technology |
CMOS |
| Maximum Supply Current (uA) |
7 |
| Accuracy |
±2.5°C(Max) |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
130 |
| Output Driver |
CMOS |
| Operating Supply Voltage (V) |
2.4 to 5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.15(Max) |
| Package Overall Width (mm) |
2.4(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
2.15 |
| Minimum PACKAGE_DIMENSION_L |
1.85 |
| Maximum PACKAGE_DIMENSION_W |
1.4 |
| Minimum PACKAGE_DIMENSION_W |
1.1 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
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PACKAGING INFO
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| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Cellular Phones |
| • Computers |
| • Power Supply Modules |
| • Battery Management |
| • FAX Machines |
| • Printers |
| • HVAC |
| • Disk Drives |
| • Appliances |
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