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• Wide Input Voltage Range: 4.5 V to 42 V
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• Internally Compensated Voltage Mode Control
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• Stable with Low ESR Ceramic Capacitors
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• 200 mΩ N-Channel MOSFET
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• ±1.5% Feedback Reference Accuracy
|
| • Switching Frequency of 500 kHz |
| • Precision Enable Pin |
| • Integrated Boot-Strap Diode |
| • Integrated Soft-Start |
| • Fully WEBENCH® Enabled |
| • SO PowerPAD (Exposed Pad) |
|
| CATALOG |
LM22674MRE-ADJ/NOPB COUNTRY OF ORIGIN
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LM22674MRE-ADJ/NOPB PARAMETRIC INFO
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LM22674MRE-ADJ/NOPB PACKAGE INFO
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LM22674MRE-ADJ/NOPB MANUFACTURING INFO
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LM22674MRE-ADJ/NOPB PACKAGING INFO
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LM22674MRE-ADJ/NOPB ECAD MODELS
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LM22674MRE-ADJ/NOPB APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
|
| Philippines |
|
PARAMETRIC INFO
|
| Type |
Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
42 |
| Output Voltage (V) |
1.285 to 37 |
| Maximum Output Current (A) |
0.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
500(Typ) |
| Efficiency (%) |
90(Min) |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
4.5 to 42 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
3400 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
0.7 |
|
|
PACKAGE INFO
|
| Supplier Package |
HSOIC EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.7(Max) |
| Seated Plane Height (mm) |
1.7(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MS-012-BA |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
E |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
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ECAD MODELS
|
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APPLICATIONS
|
• Industrial Control
|
| • Telecom and Datacom Systems |
• Embedded Systems
|
• Conversions from Standard 24 V, 12 V and 5 V Input Rails
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