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CATALOG
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LM22676MRE-5.0/NOPB COUNTRY OF ORIGIN
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LM22676MRE-5.0/NOPB PARAMETRIC INFO
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LM22676MRE-5.0/NOPB PACKAGE INFO
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LM22676MRE-5.0/NOPB MANUFACTURING INFO
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LM22676MRE-5.0/NOPB PACKAGING INFO
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LM22676MRE-5.0/NOPB ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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Philippines
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PARAMETRIC INFO
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Type |
Step Down |
Number of Outputs |
1 |
Minimum Input Voltage (V) |
4.5 |
Maximum Input Voltage (V) |
42 |
Output Voltage (V) |
5 |
Maximum Output Current (A) |
3 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Switching Frequency (kHz) |
500(Typ) |
Efficiency (%) |
90(Min) |
Switching Regulator |
Yes |
Operating Supply Voltage (V) |
4.5 to 42 |
Output Type |
Fixed |
Typical Quiescent Current (uA) |
3400 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
HSOIC EP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.55(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.7(Max) |
Seated Plane Height (mm) |
1.7(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Family Name |
SO |
Jedec |
MS-012-BA |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
250 |
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ECAD MODELS |

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