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• 3.3-V, 5-V, 12-V, and adjustable output versions
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• Adjustable version output voltage range: 1.2 V to
37 V (57-V for the HV version), ±4% maximum
over line and load conditions
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• Available in 8-pin surface-mount SOIC and 8-pin
PDIP packages
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• Ensured 0.5-A output current
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• Input voltage range up to 60 V
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• Requires only four external components
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|
| CATALOG |
| LM2594MX-3.3/NOPB COUNTRY OF ORIGIN |
LM2594MX-3.3/NOPB PARAMETRIC INFO
|
LM2594MX-3.3/NOPB PACKAGE INFO
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LM2594MX-3.3/NOPB MANUFACTURING INFO
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LM2594MX-3.3/NOPB PACKAGING INFO
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LM2594MX-3.3/NOPB ECAD MODELS
|
LM2594MX-3.3/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
|
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
Inverting|Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
40 |
| Output Voltage (V) |
3.3 |
| Maximum Output Current (A) |
0.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
173 |
| Efficiency (%) |
80(Typ) |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
4.5 to 40 |
| Output Type |
Fixed |
| Typical Quiescent Current (uA) |
5000 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
4 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
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APPLICATIONS
|
• Simple high-efficiency step-down (buck) regulator
|
| • Efficient preregulator for linear regulators |
• On-card switching regulators
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• Positive-to-negative convertor
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| |
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