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• Inverts or Doubles Input Supply Voltage
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• Narrow SOIC and VSSOP Packages
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• 6.5-Ω Typical Output Resistance
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• 88% Typical Conversion Efficiency at 100 mA
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• Selectable Oscillator Frequency: 10 kHz/80 kHz
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• Optional External Oscillator Input
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| CATALOG |
LM2661M/NOPB COUNTRY OF ORIGIN
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LM2661M/NOPB PARAMETRIC INFO
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LM2661M/NOPB PACKAGE INFO
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LM2661M/NOPB MANUFACTURING INFO
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LM2661M/NOPB PACKAGING INFO
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LM2661M/NOPB ECAD MODELS
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LM2661M/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
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United States of America
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PARAMETRIC INFO
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| Function |
Inverting/Step Up |
| Efficiency (%) |
99.96(Typ) |
| Minimum Operating Supply Voltage (V) |
1.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Output Voltage (V) |
-1.5 to -5.5 |
| Output Type |
Adjustable |
| Output Current (mA) |
100(Min) |
| Switching Frequency (kHz) |
5(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Power Dissipation (mW) |
735 |
| Supplier Temperature Grade |
Industrial |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
4 |
| Standard |
IPC-1752 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
M |
| Packaging |
Tube |
| Quantity Of Packaging |
95 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Laptop Computers |
| • Cellular Phones |
| • Medical Instruments |
| • Operational Amplifier Power Supplies |
| • Interface Power Supplies |
| • Handheld Instruments |
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