LM2671M-ADJ/NOPB Texas Instruments IC REG BUCK ADJ 0.5A 8-SOIC

label:
2024/01/30 206



• Efficiency up to 96%
• Available in 8-Pin SOIC, PDIP, and WSON Packages
• Simple and Easy to Design With
• Requires Only 5 External Components
• Uses Readily Available Standard Inductors
• 3.3-V, 5-V, 12-V, and Adjustable Output Versions
• Adjustable Version Output Voltage Range: 1.21 V to 37 V
• ±1.5% Maximum Output Voltage Tolerance Over Line and Load Conditions
• Ensured 500-mA Output Load Current
• 0.25-Ω DMOS Output Switch  
• Wide Input Voltage Range: 8 V to 40 V
• 260-kHz Fixed Frequency Internal Oscillator
• TTL Shutdown Capability, Low Power Standby Mode
• Soft-Start and Frequency Synchronization
• Thermal Shutdown and Current-Limit Protection


CATALOG
LM2671M-ADJ/NOPB COUNTRY OF ORIGIN
LM2671M-ADJ/NOPB PARAMETRIC INFO
LM2671M-ADJ/NOPB PACKAGE INFO
LM2671M-ADJ/NOPB MANUFACTURING INFO
LM2671M-ADJ/NOPB PACKAGING INFO
LM2671M-ADJ/NOPB ECAD MODELS
LM2671M-ADJ/NOPB APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Philippines


PARAMETRIC INFO
Type Synchronous Step Down
Number of Outputs 1
Minimum Input Voltage (V) 8
Maximum Input Voltage (V) 40
Output Voltage (V) 1.21 to 37
Maximum Output Current (A) 0.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Switching Frequency (kHz) 260(Typ)
Process Technology LMDMOS
Efficiency (%) 90(Typ)
Switching Regulator Yes
Operating Supply Voltage (V) 6.5 to 40
Output Type Adjustable
Typical Quiescent Current (uA) 2500
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Switch Current (A) 0.8


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix M
Packaging Tube
Quantity Of Packaging 95
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Simple High Efficiency (> 90%) Step-Down (Buck) Regulators
• Efficient Preregulator for Linear Regulators

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