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• Efficiency up to 96%
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• Available in 8-Pin SOIC, PDIP, and 16-Pin WSON Package
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• Requires only 5 External Components
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| • 3.3-V, 5-V, 12-V, and Adjustable Output Versions |
| • Adjustable Version Output Voltage Range: 1.21 V to 37 V |
| • ±1.5% Maximum Output Voltage Tolerance Over Line and Load Conditions |
| • Ensured 1-A Output Load Current |
| • Wide Input Voltage Range: 8 V to 40 V |
| • 260-kHz Fixed Frequency Internal Oscillator |
| • TTL Shutdown Capability, Low-Power Standby Mode |
| • Thermal Shutdown and Current Limit Protection |
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| CATALOG |
| LM2675MX-5.0/NOPB COUNTRY OF ORIGIN |
LM2675MX-5.0/NOPB PARAMETRIC INFO
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LM2675MX-5.0/NOPB PACKAGE INFO
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LM2675MX-5.0/NOPB MANUFACTURING INFO
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LM2675MX-5.0/NOPB PACKAGING INFO
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LM2675MX-5.0/NOPB EACD MODELS
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| LM2675MX-5.0/NOPB APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Mexico |
| China |
| Malaysia |
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PARAMETRIC INFO
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| Type |
Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
8 |
| Maximum Input Voltage (V) |
40 |
| Output Voltage (V) |
5 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
260(Typ) |
| Efficiency (%) |
90(Typ) |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
6.5 to 40 |
| Output Type |
Fixed |
| Typical Quiescent Current (uA) |
2500 |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Simple High Efficiency (>90%) Step-Down (Buck)Regulator
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| • Efficient Preregulator for Linear Regulators |
| • Positive-to-Negative Converter |
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