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• Input−to−Output Voltage Differential of < 0.6 V @ 100 mA
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• Output Current in Excess of 100 mA
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• Low Bias Current
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• 60 V Load Dump Protection |
• −50 V Reverse Transient Protection |
• Internal Current Limiting with Thermal Shutdown |
• Temporary Mirror−Image Protection |
• Ideally Suited for Battery Powered Equipment |
• Economical 5−Lead TO−220 Package with Two Optional Leadforms |
• Available in Surface Mount SOP−8, D2PAK and DPAK Packages |
• High Accuracy (2.5%) Reference (LM2931AC) Available |
• NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable |
• Pb−Free Packages are Available |
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CATALOG |
LM2931CDR2G COUNTRY OF ORIGIN |
LM2931CDR2G PARAMETRIC INFO
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LM2931CDR2G PACKAGE INFO
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LM2931CDR2G MANUFACTURING INFO
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LM2931CDR2G PACKAGING INFO
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LM2931CDR2G EACD MODELS
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LM2931CDR2G APPLICATIONS |
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COUNTRY OF ORIGIN |
Philippines |
China |
Thailand |
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PARAMETRIC INFO
|
Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.1(Min) |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Adjustable |
Output Voltage Range (V) |
1.8 to 10|10 to 20|20 to 50 |
Junction to Ambient |
160°C/W |
Junction to Case |
25°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Thermal Shutdown Protection |
Load Regulation |
1%/V |
Line Regulation |
1.5mV/V |
Maximum Dropout Voltage @ Current (V) |
0.2@10mA|0.6@100mA |
Minimum Input Voltage (V) |
2.5 |
Maximum Input Voltage (V) |
40 |
Output Voltage (V) |
2.7 to 29.5 |
Typical Dropout Voltage @ Current (V) |
0.015@10mA|0.16@100mA |
Reference Voltage (V) |
1.26 |
Accuracy (%) |
±5 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
5 to 6 |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
CuFeZnPAg |
Number of Wave Cycles |
2 |
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PACKAGING INFO
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Packaging Suffix |
R2 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS |
• Battery Powered Consumer Products |
• Hand−held Instruments |
• Camcorders and Cameras |
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