|
|
• 1.5-A Output Current
|
• Line Regulation 0.01%/V (Typical)
|
• Load Regulation 0.3% (Typical)
|
• 77-dB Ripple Rejection
|
• 50 ppm/°C Temperature Coefficient
|
• Thermal Overload Protection
|
• Internal Short-Circuit Current Limiting Protections
|
|
| CATALOG |
| LM337IMPX/NOPB COUNTRY OF ORIGIN |
LM337IMPX/NOPB PARAMETRIC INFO
|
LM337IMPX/NOPB PACKAGE INFO
|
LM337IMPX/NOPB MANUFACTURING INFO
|
LM337IMPX/NOPB PACKAGING INFO
|
LM337IMPX/NOPB ECAD MODELS
|
LM337IMPX/NOPB APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Malaysia |
China
|
United States of America
|
|
PARAMETRIC INFO
|
| Type |
Standard |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
1.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Adjustable |
| Output Voltage Range (V) |
<1.8 |
| Junction to Ambient |
58.3°C/W |
| Junction to Case |
36.6°C/W |
| Polarity |
Negative |
| Special Features |
Current Limit|Safe Area Protection|Short Circuit Protection|Thermal Shutdown Protection |
| Load Regulation |
1% |
| Line Regulation |
0.04%/V |
| Maximum Power Dissipation (mW) |
2000 |
| Minimum Input Voltage (V) |
-4.2 |
| Maximum Input Voltage (V) |
-4.2 |
| Output Voltage (V) |
-1.2 to -37 |
| Typical Quiescent Current (mA) |
0.065 |
| Reference Voltage (V) |
-1.287 |
| Accuracy (%) |
±4 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical PSRR (dB) |
77 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-223 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.3 |
| Package Length (mm) |
6.7(Max) |
| Package Width (mm) |
3.7(Max) |
| Package Height (mm) |
1.7(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.8(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-261AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
X |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Industrial Power Supplies
|
• Factory Automation Systems
|
• Building Automation Systems
|
• PLC Systems
|
• Instrumentation
|
• IGBT Drive Negative Gate Supplies
|
• Networking
|
• Set-Top Boxes
|
| |
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