LM339NG onsemi IC COMPARATOR QUAD SGL 14-DIP

label:

2026/01/4 22

LM339NG onsemi IC COMPARATOR QUAD SGL 14-DIP

• Single Supply Operation: 3.0 V to 36 V

• Split Supply Operation: ±1.5 V to ±18 V

• Low Input Bias Current: 25 nA (Typ)

• Low Input Offset Current: ±5.0 nA (Typ)

• Low Input Offset Voltage

• Input Common Mode Voltage Range to GND

CATALOG

LM339NG LIFECYCLE

LM339NG PARAMETRIC INFO

LM339NG PACKAGE INFO

LM339NG MANUFACTURING INFO

LM339NG PACKAGING INFO

LM339NG ECAD MODELS

Obsolete
Jul 12,2019

PARAMETRIC INFO

Rail to Rail	No
Manufacturer Type	General Purpose Comparator
Number of Channels per Chip	4
Output Type	Open Collector
Maximum Input Offset Voltage (mV)	5@5V
Maximum Input Bias Current (uA)	0.25@5V
Typical Voltage Gain (dB)	106.02
Typical Voltage Gain Range (dB)	90 to 110
Strobe Capability	No
Typical Output Current (mA)	16@5V
Typical Response Time (us)	1.3
Typical Response Time Range (us)	0.5 to 5
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	70
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Power Supply Type	Single\|Dual
Minimum Test Temperature (°C)	0
Integrated Voltage Reference	No
Maximum Operating Supply Voltage (V)	±18\|36
Maximum Test Temperature (°C)	70
Integrated OP Amp	No
Minimum Single Supply Voltage (V)	3
Typical Single Supply Voltage (V)	5\|9\|12\|15\|18\|24\|28
Maximum Single Supply Voltage (V)	36
Minimum Dual Supply Voltage (V)	±1.5
Typical Dual Supply Voltage (V)	±3\|±5\|±9\|±12\|±15
Maximum Dual Supply Voltage (V)	±18
Maximum Quiescent Current (mA)	2@5V
Maximum Power Dissipation (mW)	1000

Supplier Package	PDIP
Basic Package Type	Through Hole
Pin Count	14
Lead Shape	Through Hole
PCB	14
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	19.69(Max)
Package Width (mm)	7.11(Max)
Package Height (mm)	4.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	19.56(Max)
Package Overall Width (mm)	8.26(Max)
Package Overall Height (mm)	5.33(Max)
Seated Plane Height (mm)	5.33(Max)
Mounting	Through Hole
Terminal Width (mm)	0.56(Max) (Lower)\|1.52 (Upper)
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Plastic Dual In Line Package
Package Family Name	DIP
Jedec	MS-001AA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Maximum Wave Temperature (°C)	260
Wave Solder Time (Sec)	5 to 6
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Shelf Life Period	N/A
Shelf Life Condition	N/A
Number of Wave Cycles	2

Packaging	Tube
Quantity Of Packaging	25