|
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• Calibrated Directly in Celsius (Centigrade)
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• Linear + 10-mV/°C Scale Factor
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• 0.5°C Ensured Accuracy (at 25°C)
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• Rated for Full −55°C to 150°C Range
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• Suitable for Remote Applications
|
• Low-Cost Due to Wafer-Level Trimming
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• Operates From 4 V to 30 V
|
• Less Than 60-μA Current Drain
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• LowSelf-Heating, 0.08°C in Still Air
|
|
| CATALOG |
LM35DZ/LFT1 COUNTRY OF ORIGIN
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LM35DZ/LFT1 PARAMETRIC INFO
|
LM35DZ/LFT1 PACKAGE INFO
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LM35DZ/LFT1 MANUFACTURING INFO
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LM35DZ/LFT1 PACKAGING INFO
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LM35DZ/LFT1 ECAD MODELS
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LM35DZ/LFT1 APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Malaysia
|
|
PARAMETRIC INFO
|
| Function |
Temp Sensor |
| Interface Type |
Serial (2-Wire) |
| Sensor Gain |
10mV/°C |
| Output Type |
Analog |
| Module/IC Classification |
IC |
| Minimum Operating Supply Voltage (V) |
4 |
| Typical Operating Supply Voltage (V) |
5|9|12|15|18|24 |
| Operating Temperature (°C) |
0 to 100 |
| Operating Range |
0°C to 100°C |
| Maximum Output Voltage (V) |
6 |
| Minimum Output Voltage (V) |
-1 |
| Topology |
v(1,1) |
| Linearity |
Yes |
| Response Point List |
(0,0),(100,1) |
| Minimum Temperature Sensing (°C) |
0 |
| Maximum Operating Supply Voltage (V) |
30 |
| Maximum Temperature Sensing (°C) |
100 |
| Accuracy |
±0.6°C |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
100 |
| Operating Supply Voltage (V) |
4 to 30 |
| Minimum Storage Temperature (°C) |
-60 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TO-92 |
| Basic Package Type |
Through Hole |
| Pin Count |
3 |
| Lead Shape |
Formed |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
5.2(Max) |
| Package Width (mm) |
4.19(Max) |
| Package Height (mm) |
5.2(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
5.2(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Plastic Header Style Package |
| Package Family Name |
TO |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
14.17 |
| Reel Width (mm) |
41 |
| Tape Pitch (mm) |
12.7 |
| Tape Width (mm) |
18.5 |
| Feed Hole Pitch (mm) |
12.7 |
| Hole Center to Component Center (mm) |
6.35 |
| Lead Clinch Height (mm) |
16 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Power Supplies
|
| • Battery Management |
| • HVAC |
| • Appliances |
|
| |
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