LM3881MMX/NOPB Winbond IC FLASH 16M SPI 133MHZ 8SOIC

Output Driver	Active High/Open Drain
Manual Reset	No
Watchdog Timer	No
Number of Supervisors	3
Typical Reset Threshold Voltage (V)	1.22
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Chip Enable Signals	Yes
Power Fail Detection	No
Battery Backup Switching	No
Maximum Operating Supply Voltage (V)	5.5
Minimum Reset Threshold Voltage (V)	1
Maximum Reset Threshold Voltage (V)	1.4
Minimum Operating Supply Voltage (V)	2.7
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Type	Power Supply Sequencer
Programmability	No

Supplier Package	VSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	8
Lead Shape	Gull-wing
PCB	8
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	3.1(Max)
Package Width (mm)	3.1(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.1(Max)
Package Overall Width (mm)	5.05(Max)
Package Overall Height (mm)	1.1(Max)
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Very Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-187
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H	0.95
Minimum PACKAGE_DIMENSION_H	N/A
Maximum PACKAGE_DIMENSION_L	3.1
Minimum PACKAGE_DIMENSION_L	2.9
Maximum PACKAGE_DIMENSION_W	3.1
Minimum PACKAGE_DIMENSION_W	2.9
Maximum Diameter	N/R
Minimum Diameter	N/R
Maximum Seated_Plane_Height	1.1
Minimum Seated_Plane_Height	N/A

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

• Security Cameras

• Servers

• Networking Elements

• FPGA Sequencing

• Microprocessor and Microcontroller Sequencing

• Multiple Supply Sequencing