|
|
• Input Voltage Range: 4.5 V to 5.5 V
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• Output Voltage Specified over Temperature
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• Excellent Load Regulation
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• Specified 1-A Output Current
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• Requires only One External Component
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• Built-in Protection against Excess Temperature
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|
| CATALOG |
| LM3940IMPX-3.3/NOPB COUNTRY OF ORIGIN |
LM3940IMPX-3.3/NOPB PARAMETRIC INFO
|
LM3940IMPX-3.3/NOPB PACKAGE INFO
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LM3940IMPX-3.3/NOPB MANUFACTURING INFO
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LM3940IMPX-3.3/NOPB PACKAGING INFO
|
LM3940IMPX-3.3/NOPB ECAD MODELS
|
LM3940IMPX-3.3/NOPB APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Fixed |
| Output Voltage Range (V) |
1.8 to 10 |
| Junction to Ambient |
59.3°C/W |
| Junction to Case |
38.9°C/W |
| Polarity |
Positive |
| Special Features |
Short Circuit Protection|Thermal Shutdown Protection |
| Load Regulation |
50mV |
| Line Regulation |
40mV |
| Maximum Quiescent Current (mA) |
15 |
| Maximum Dropout Voltage @ Current (V) |
0.8@1A|0.15@100mA |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
3.3 |
| Typical Quiescent Current (mA) |
10 |
| Typical Dropout Voltage @ Current (V) |
0.11@100mA|0.5@1A |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Output Noise Voltage (uVrms) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-223 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.3 |
| Package Length (mm) |
6.7(Max) |
| Package Width (mm) |
3.7(Max) |
| Package Height (mm) |
1.7(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.8(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-261AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
|
|
ECAD MODELS
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APPLICATIONS
|
• Laptop and Desktop Computers
|
| • Logic Systems |
| |
| |
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