 |
|
| • Fixed Output Voltages of 2.048 V, 2.5 V, 3 V,
4.096 V, 5 V, 8.192 V, and 10 V |
• Tight Output Tolerances and Low Temperature
Coefficient
– Max 0.1%, 100 ppm/°C – A Grade
– Max 0.2%, 100 ppm/°C – B Grade
– Max 0.5%, 100 ppm/°C – C Grade
– Max 1.0%, 150 ppm/°C – D Grade |
| • Low Output Noise: 35 μVRMS Typ
|
| • Wide Operating Current Range: 45 μA Typ to 15
mA |
| • Stable With All Capacitive Loads; No Output
Capacitor Required |
| • Available in Extended Temperature Range: –40°C
to 125°C |
|
| CATALOG |
| LM4040C25QDBZR COUNTRY OF ORIGIN |
| LM4040C25QDBZR PARAMETRIC INFO |
| LM4040C25QDBZR PACKAGE INFO |
| LM4040C25QDBZR MANUFACTURING INFO |
| LM4040C25QDBZR PACKAGING INFO |
| LM4040C25QDBZR ECAD MODELS |
| LM4040C25QDBZR FUNCTIONAL BLOCK DIAGRAM |
| LM4040C25QDBZR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Thailand |
| China |
|
| PARAMETRIC INFO |
| Topology |
Shunt |
| Reference Type |
Precision |
| Output Voltage (V) |
2.5 |
| Initial Accuracy |
0.5% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
6mV |
| Maximum Output Current (mA) |
15 |
| Maximum Temperature Coefficient |
20ppm/°C(Typ) |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.04(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Seated Plane Height (mm) |
1.12(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9.2 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Data-Acquisition Systems |
| • Power Supplies and Power-Supply Monitors |
| • Instrumentation and Test Equipment |
| • Process Controls |
| • Precision Audio
|
| • Automotive Electronics |
| • Energy Management |
| • Battery-Powered Equipment |
| |
|
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