LM48511SQ/NOPB Texas Instruments LM48511 3-W, Ultra-Low EMI, Filterless, Mono, Class D Audio Power Amplifier With Spread Spectrum

label:
2025/05/5 4
LM48511SQ/NOPB Texas Instruments LM48511 3-W, Ultra-Low EMI, Filterless, Mono, Class D Audio Power Amplifier With Spread Spectrum


• 3-W Output into 8 Ω at 5 V With THD+N = 1%
• Selectable spread spectrum mode reduces EMI
• 80% Efficiency
• Independent regulator and amplifier shutdown controls
• Dynamically Selectable Regulator Output Voltages
• Filterless Class D
• 3-V to 5.5-V Operation


CATALOG
LM48511SQ/NOPB COUNTRY OF ORIGIN
LM48511SQ/NOPB PARAMETRIC INFO
LM48511SQ/NOPB PACKAGE INFO
LM48511SQ/NOPB MANUFACTURING INFO
LM48511SQ/NOPB PACKAGING INFO
LM48511SQ/NOPB ECAD MODELS
LM48511SQ/NOPB APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia
Philippines


PARAMETRIC INFO
Amplifier Type Class-D
Function Speaker
Rail to Rail No
Input Signal Type Differential
Output Signal Type Differential
Output Type 1-Channel Mono
Power Supply Type Triple
Minimum Dual Supply Voltage (V) 3|4.8
Typical Dual Supply Voltage (V) 5
Maximum Dual Supply Voltage (V) 5.5|8
Maximum Load Resistance (Ohm) 8
Typical Output Power (W) 6.7
Typical Output Power x Channels @ Load (W) 6.7x1@4Ohm
Typical PSRR (dB) 88
Typical Quiescent Current (mA) 14.5@5V
Maximum Quiescent Current (mA) 22@5V
Minimum CMRR (dB) 73(Typ)
Total Harmonic Distortion Noise 0.05%@4Ohm@3W|0.03%@8Ohm@2W
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85


PACKAGE INFO
Supplier Package WQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 24
Lead Shape No Lead
PCB 24
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 5
Package Width (mm) 4
Package Height (mm) 0.8(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5
Package Overall Width (mm) 4
Package Overall Height (mm) 0.8(Max)
Seated Plane Height (mm) 0.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Very Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 1000
Packaging Document Link to Datasheet

ECAD MODELS


APPLICATIONS
• GPS
• Portable media
• Cameras
• Mobile phones
• Handheld games
Продукт RFQ