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• LM5010A-Q1 Qualified for AutomotiveApplications
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• AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to 125°CAmbient Operating Temperature Range
– Device Temperature Grade 0: –40°C to 150°CAmbient Operating Temperature Range
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C5
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• Wide 6-V to 75-V Input Voltage Range
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• Valley Current Limit at 1.25 A
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• Programmable Switching Frequency Up To 1 MHz
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• Integrated 80-V N-Channel Buck Switch
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• Integrated High Voltage Bias Regulator
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• No Loop Compensation Required
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• Ultra-Fast Transient Response
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• Nearly Constant Operating Frequency With Lineand Load Variations
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• Adjustable Output Voltage
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• 2.5-V, ±2% Feedback Reference
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• Programmable Soft-Start
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• Thermal Shutdown
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• Exposed Thermal Pad for Improved HeatDissipation
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CATALOG |
LM5010ASD/NOPB COUNTRY OF ORIGIN
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LM5010ASD/NOPB PARAMETRIC INFO
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LM5010ASD/NOPB PACKAGE INFO
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LM5010ASD/NOPB MANUFACTURING INFO
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LM5010ASD/NOPB PACKAGING INFO
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LM5010ASD/NOPB ECAD MODELS
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LM5010ASD/NOPB FUNCTIONAL BLOCK DIAGRAM
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LM5010ASD/NOPB APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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Thailand
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PARAMETRIC INFO
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Type |
Step Down |
Number of Outputs |
1 |
Minimum Input Voltage (V) |
6 |
Maximum Input Voltage (V) |
75 |
Output Voltage (V) |
2.5 to 70 |
Maximum Output Current (A) |
1 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Switching Frequency (kHz) |
50 to 1000 |
Efficiency (%) |
91 |
Switching Regulator |
Yes |
Operating Supply Voltage (V) |
6 to 75 |
Output Type |
Adjustable |
Typical Quiescent Current (uA) |
650 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
WSON EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
10 |
Lead Shape |
No Lead |
PCB |
10 |
Tab |
N/R |
Pin Pitch (mm) |
0.8 |
Package Length (mm) |
4.1(Max) |
Package Width (mm) |
4.1(Max) |
Package Height (mm) |
0.75(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.1(Max) |
Package Overall Width (mm) |
4.1(Max) |
Package Overall Height (mm) |
0.8(Max) |
Seated Plane Height (mm) |
0.8(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
Package Family Name |
SON |
Jedec |
N/A |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
40 |
Number of Reflow Cycle |
4 |
Standard |
IPC-1752 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn|Au |
Under Plating Material |
N/A|Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
1000 |
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ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM
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APPLICATIONS
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• Non-Isolated Telecommunications Regulators
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• Secondary Side Post Regulators
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• Automotive Electronics
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