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• LM50-Q1 is AEC-Q100 Grade 1 Qualified and is Manufactured on an Automotive Grade Flow
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• Calibrated Directly in Degrees Celsius (Centigrade)
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• Linear + 10 mV/°C Scale Factor
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| • ±2°C Accuracy Specified at 25°C
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| • Specified for Full –40° to 125°C Range |
| • Suitable for Remote Applications |
| • Low Cost Due to Wafer-Level Trimming |
| • Operates From 4.5 V to 10 V |
| • Less Than 130-µA Current Drain |
| • Low Self-Heating: Less Than 0.2°C in Still A |
| • Nonlinearity Less Than 0.8°C Over Temp |
| • UL Recognized Component |
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| CATALOG |
| LM50CIM3X/NOPB COUNTRY OF ORIGIN |
LM50CIM3X/NOPB PARAMETRIC INFO
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LM50CIM3X/NOPB PACKAGE INFO
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LM50CIM3X/NOPB MANUFACTURING INFO
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LM50CIM3X/NOPB PACKAGING INFO
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LM50CIM3X/NOPB EACD MODELS
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| LM50CIM3X/NOPB APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
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PARAMETRIC INFO
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| Function |
Temp Sensor |
| Sensor Gain |
10.3mV/°C(Max) |
| Output Type |
Analog |
| Module/IC Classification |
IC |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5|9 |
| Maximum Operating Supply Voltage (V) |
10 |
| Maximum Output Voltage (V) |
1.75 |
| Minimum Output Voltage (V) |
0.1 |
| Topology |
v(1,1) |
| Response Point List |
(-25,0.25),(100,1.5) |
| Minimum Temperature Sensing (°C) |
-40 |
| Maximum Temperature Sensing (°C) |
125 |
| Operating Temperature (°C) |
-40 to 125 |
| Operating Range |
-40°C to 125°C |
| Maximum Supply Current (uA) |
130 |
| Accuracy |
±3°C(Max) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Operating Supply Voltage (V) |
4.5 to 10 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier packaging |
SOT-23 |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
3 |
| Pin shape |
Gull-wing |
| PCB |
3 |
| ears |
N/R |
| Pin spacing (mm) |
0.95 |
| Package length (mm) |
3.04(Max) |
| Package width (mm) |
1.4(Max) |
| Package height (mm) |
0.95 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Mounting surface height (mm) |
1.12(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline Transistor |
| Package series name |
SOT |
| JEDEC |
TO-236AB |
| Package outline |
Link to datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
260 |
| Wave soldering time (seconds) |
4 |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Matt Sn |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
not applicable |
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PACKAGING INFO
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| Packaging Suffix |
X |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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APPLICATIONS
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• Automotive
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| • Computers |
| • Disk Drives |
| • Battery Management |
| • FAX Machines |
• Printers
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| • Portable Medical Instruments |
| • HVAC |
| • Power Supply Modules |
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