|
|
• Wide 4.5-V to 100-V Input Voltage Range
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• Integrated High-Side and Low-Side Switches– No Schottky Diode Required
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• 1-A Maximum Load Current
|
| • Constant ON-Time Control– No External Loop Compensation– Fast Transient Response
|
| • Selectable DCM Buck Operation at Light Load |
| • CCM Option Supports Multi-Output Fly-Buck™ |
| • No External Ripple circuit needed (at FPWM = 0) |
| • Nearly Constant Switching Frequency |
| • Frequency Adjustable Up to 1 MHz |
| • Programmable Soft-Start Time |
| • Prebias Start-Up |
| • Peak Current Limiting Protection |
|
| CATALOG |
| LM5161PWPR COUNTRY OF ORIGIN |
LM5161PWPR PARAMETRIC INFO
|
LM5161PWPR PACKAGE INFO
|
LM5161PWPR MANUFACTURING INFO
|
LM5161PWPR PACKAGING INFO
|
LM5161PWPR EACD MODELS
|
| LM5161PWPR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
PARAMETRIC INFO
|
| type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
100 |
| Output Voltage (V) |
-1.5 to 100 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
50 to 1000 |
| Switching Regulator |
yes |
| Operating Supply Voltage (V) |
4.5 to 100 |
| Output Type |
Adjustable |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
1.61 |
|
|
PACKAGE INFO
|
| Supplier packaging |
HTSSOP EP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
14 |
| Pin shape |
Gull-wing |
| PCB |
14 |
| ears |
N/R |
| Pin spacing (mm) |
0.65 |
| Package length (mm) |
5.1(Max) |
| Package width (mm) |
4.5(Max) |
| Package height (mm) |
1.05(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Mounting surface height (mm) |
1.2(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package series name |
SO |
| JEDEC |
MO-153ABT-1 |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matt Sn |
| Plating materials |
not applicable |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
2500 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Industrial Programmable Logic Controller
|
| • IGBT Gate Drive Bias Supply |
| • Telecom DC-DC Primary and Secondary Side Bias |
| • E-Meter Power Line Communication |
| • Low-Power (<12W), Isolated DC-DC (Fly-Buck) |
| |
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