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• Meets automotive ISO7637 transient requirements with a suitable TVS Diode
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• Fast response to reverse current blocking:< 0.75 µs
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• 2.3-A peak gate turnoff current
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• 80-µA operating quiescent current (EN=High)
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• 3.2-V to 65-V input range (3.9-V start up)
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• –65-V reverse voltage rating
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• Charge pump for external N-Channel MOSFET
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• 20-mV ANODE to CATHODE forward voltage drop regulation
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• Enable pin feature
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• 1-µA shutdown current (EN=Low
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| CATALOG |
LM74700QDBVRQ1 Country of Origin
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LM74700QDBVRQ1 PARAMETRIC INFO
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LM74700QDBVRQ1 PACKAGE INFO
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LM74700QDBVRQ1 MANUFACTURING INFO
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LM74700QDBVRQ1 PACKAGING INFO
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LM74700QDBVRQ1 ECAD MODELS
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LM74700QDBVRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Philippines
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Thailand
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PARAMETRIC INFO
|
| FET Type |
N-Channel |
| Number of Drivers |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
| Minimum Operating Supply Voltage (V) |
3.2 |
| Maximum Operating Supply Voltage (V) |
65 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
150 |
|
|
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.5(Max) |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.3 |
| Minimum PACKAGE_DIMENSION_H |
0.9 |
| Maximum PACKAGE_DIMENSION_L |
3.05 |
| Minimum PACKAGE_DIMENSION_L |
2.75 |
| Maximum PACKAGE_DIMENSION_W |
1.75 |
| Minimum PACKAGE_DIMENSION_W |
1.45 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.45 |
| Minimum Seated_Plane_Height |
0.9 |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
|
| |
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Automotive ADAS systems - camera |
| • Automotive infotainment systems - digital cluster,head unit |
| • Industrial factory automation - PLC |
| • Enterprise power supplies |
| • Active ORing for redundant power |
| |
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