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• Rail-to-rail input common-mode voltage range (specified over temperature)
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• Rail-to-rail output swing (within 20mV of supply rail, 100kΩ load)
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• Specified 3V, 5V, and 15V performance
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• Excellent CMRR and PSRR: 82dB |
• Ultra-low input current: 20fA |
• Specified for 2kΩ and 600Ω loads |
• Improved replacement for TLC272, TLC277 |
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CATALOG |
LMC6484AIMX/NOPB COUNTRY OF ORIGIN |
LMC6484AIMX/NOPB PARAMETRIC INFO
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LMC6484AIMX/NOPB PACKAGE INFO
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LMC6484AIMX/NOPB MANUFACTURING INFO
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LMC6484AIMX/NOPB PACKAGING INFO
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LMC6484AIMX/NOPB EACD MODELS
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LMC6484AIMX/NOPB APPLICATIONS |
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COUNTRY OF ORIGIN |
Malaysia |
Mexico |
China |
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PARAMETRIC INFO
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Manufacturer Type |
Precision Amplifier |
Type |
Precision Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
3 |
Number of Channels per Chip |
4 |
Process Technology |
CMOS |
Minimum PSRR (dB) |
70 |
Typical Single Supply Voltage (V) |
5|9|12|15 |
Maximum Single Supply Voltage (V) |
15.5 |
Output Type |
CMOS |
Typical Gain Bandwidth Product (MHz) |
1.5 |
Maximum Input Offset Voltage (mV) |
0.75@5V |
Maximum Input Offset Current (uA) |
0.00000001(Typ)@5V |
Maximum Operating Supply Voltage (V) |
15.5 |
Maximum Input Bias Current (uA) |
0.000004@5V@-40C to 85C |
Minimum CMRR (dB) |
70 |
Maximum Supply Voltage Range (V) |
15 to 16 |
Minimum CMRR Range (dB) |
70 to 71 |
Typical Voltage Gain (dB) |
116.47 |
Typical Slew Rate (V/us) |
1.3@5V |
Typical Output Current (mA) |
30(Max) |
Typical Input Noise Voltage Density (nV/rtHz) |
37@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.03@5V |
Typical Input Bias Current (uA) |
0.00000002@3V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Power Supply Type |
Single |
Maximum Supply Current (mA) |
2.8@5V |
Input Offset Voltage Drift (uV/°C) |
±1(Typ)@(-40 to 85) |
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PACKAGE INFO
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Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
14 |
Lead Shape |
Gull-wing |
PCB |
14 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
8.75(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
8.75(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging Suffix |
X |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
16 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS |
• Data acquisition (DAQ) |
• Currency counter |
• Oscilloscope (DSO) |
• Intra-DC interconnect (METRO) |
• Macro remote radio unit (RRU)
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• Multiparameter patient monitor |
• Merchant telecom rectifiers |
• Train control and management |
• Process analytics (pH, gas, concentration, force,and humidity) |
• Three phase UPS |
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