LMC6484AIMX/NOPB Texas Instruments LMC648x CMOS Rail-to-Rail Input and Output Operational Amplifiers

label:
2024/05/30 320

• Rail-to-rail input common-mode voltage range (specified over temperature)
• Rail-to-rail output swing (within 20mV of supply rail, 100kΩ load)
• Specified 3V, 5V, and 15V performance
• Excellent CMRR and PSRR: 82dB
• Ultra-low input current: 20fA
• Specified for 2kΩ and 600Ω loads
• Improved replacement for TLC272, TLC277

CATALOG
LMC6484AIMX/NOPB COUNTRY OF ORIGIN
LMC6484AIMX/NOPB PARAMETRIC INFO
LMC6484AIMX/NOPB PACKAGE INFO
LMC6484AIMX/NOPB MANUFACTURING INFO
LMC6484AIMX/NOPB PACKAGING INFO
LMC6484AIMX/NOPB EACD MODELS
LMC6484AIMX/NOPB APPLICATIONS



COUNTRY OF ORIGIN
Malaysia
Mexico
China



PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 3
Number of Channels per Chip 4
Process Technology CMOS
Minimum PSRR (dB) 70
Typical Single Supply Voltage (V) 5|9|12|15
Maximum Single Supply Voltage (V) 15.5
Output Type CMOS
Typical Gain Bandwidth Product (MHz) 1.5
Maximum Input Offset Voltage (mV) 0.75@5V
Maximum Input Offset Current (uA) 0.00000001(Typ)@5V
Maximum Operating Supply Voltage (V) 15.5
Maximum Input Bias Current (uA) 0.000004@5V@-40C to 85C
Minimum CMRR (dB) 70
Maximum Supply Voltage Range (V) 15 to 16
Minimum CMRR Range (dB) 70 to 71
Typical Voltage Gain (dB) 116.47
Typical Slew Rate (V/us) 1.3@5V
Typical Output Current (mA) 30(Max)
Typical Input Noise Voltage Density (nV/rtHz) 37@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.03@5V
Typical Input Bias Current (uA) 0.00000002@3V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Maximum Supply Current (mA) 2.8@5V
Input Offset Voltage Drift (uV/°C) ±1(Typ)@(-40 to 85)



PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 8.75(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AB
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix X
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet



ECAD MODELS




APPLICATIONS
• Data acquisition (DAQ)
• Currency counter
• Oscilloscope (DSO)
• Intra-DC interconnect (METRO)
• Macro remote radio unit (RRU)
• Multiparameter patient monitor
• Merchant telecom rectifiers
• Train control and management
• Process analytics (pH, gas, concentration, force,and humidity)
• Three phase UPS
Продукт RFQ